Influence of gate length on ESD-performance for deep sub micron CMOS technology
暂无分享,去创建一个
The ESD performance of grounded-gate nMOS protection structures has been observed for a standard 0.25 /spl mu/m CMOS epitaxial layer based technology. The shortest gate lengths show unexpectedly lower ESD thresholds, leading to an optimum performance for longer gate length devices attributed to the trade-off between power dissipation and melt volume of the parasitic bipolar device.
[1] A. Amerasekera,et al. Characterization and modeling of second breakdown in NMOST's for the extraction of ESD-related process and design parameters , 1991 .
[2] A. Amerasekera,et al. Correlating drain junction scaling, salicide thickness, and lateral NPN behavior, with the ESD/EOS performance of a 0.25 /spl mu/m CMOS process , 1996, International Electron Devices Meeting. Technical Digest.
[3] Guido Groeseneken,et al. ESD protection methodology for deep-sub-micron CMOS , 1998 .