Electrical Characterization of Screen-Printed Circuits on the Fabric

Fabrication methods of planar printed circuits on fabrics are introduced and their electrical characteristics are measured and analyzed. Wet patterning method like screen printing as well as dry process of sputtering are used to fabricate the patterned film electrodes on various types of fabrics. The minimum width of the patterns is 0.2 mm for screen printing and 0.1 mm for gold sputtering, and the typical sheet resistance is 134 m ¿/¿. Fabrication methods of capacitors of 1 pF-1 nF and inductors of 500 nH-1 ¿H at 10 MHz on the fabrics are also introduced. Bonding and packaging of silicon chip directly on the fabric circuit board are proposed and their mechanical properties are investigated. The ac impedance of the transmission line is measured as 201-215 ¿ with variation, and the time-domain reflectometry profile shows that the -3 dB frequency of the printed transmission line of 15 cm on the fabric is 80 MHz. A complete system composed of a fabric capacitor sensor input, a controller system-on-a-chip, and an LED array display is implemented on the fabric and its operation is demonstrated successfully.

[1]  G. Troster,et al.  Electrical characterization of textile transmission lines , 2003 .

[2]  W. Weber,et al.  Enabling technologies for disappearing electronics in smart textiles , 2003, 2003 IEEE International Solid-State Circuits Conference, 2003. Digest of Technical Papers. ISSCC..

[3]  J. Edmison,et al.  Using piezoelectric materials for wearable electronic textiles , 2002, Proceedings. Sixth International Symposium on Wearable Computers,.

[4]  Paul D. Franzon,et al.  Electrical Characterization of Transmission Lines on Nonwoven Textile Substrates , 2005 .

[5]  Anja Boisen,et al.  Scanning microscopic four-point conductivity probes , 2002 .

[6]  J. Hearle,et al.  Physical Properties of Textile Fibres , 1962 .

[7]  Stephen P. Boyd,et al.  Simple accurate expressions for planar spiral inductances , 1999, IEEE J. Solid State Circuits.

[8]  S.B. Bibikov,et al.  Radiotechnical properties of metallized fabrics , 2005, 2005 5th International Conference on Antenna Theory and Techniques.

[9]  Pëllumb Berberi,et al.  Effect of processing on electrical resistivity of textile fibers , 2001 .

[10]  Hoi-Jun Yoo,et al.  A 1.12mW Continuous Healthcare Monitor Chip Integrated on a Planar Fashionable Circuit Board , 2008, 2008 IEEE International Solid-State Circuits Conference - Digest of Technical Papers.

[11]  P. Holmes,et al.  Handbook of thick film technology , 1976 .

[12]  G. Troster,et al.  Fundamental Building Blocks for Circuits on Textiles , 2007, IEEE Transactions on Advanced Packaging.

[13]  Clyde F. Coombs,et al.  Printed Circuits Handbook , 2007 .

[14]  Neil Gershenfeld,et al.  E-broidery: Design and fabrication of textile-based computing , 2000, IBM Syst. J..

[15]  Craig A. Grimes,et al.  Design and application of a wireless, passive, resonant-circuit environmental monitoring sensor , 2001 .

[16]  Zamora,et al.  Electronic textiles: a platform for pervasive computing , 2003, Proceedings of the IEEE.

[17]  Sungmee Park,et al.  The wearable motherboard: a framework for personalized mobile information processing (PMIP) , 2002, Proceedings 2002 Design Automation Conference (IEEE Cat. No.02CH37324).

[18]  G. D. Alley Interdigital Capacitors and Their Application to Lumped-Element Microwave Integrated Circuits , 1970 .

[19]  Koviljka A. Asanovic,et al.  Investigation of the electrical behavior of some textile materials , 2007 .

[20]  R. Simons Coplanar waveguide circuits, components, and systems , 2001 .

[21]  C. Harper Electronic Packaging and Interconnection Handbook , 2000 .