Mechanical behavior of 30–50 nm thick aluminum films under uniaxial tension

Abstract We present uniaxial tensile test results for 30–50 nm thick freestanding aluminum films. Young’s modulus and ductility were found to decrease monotonically with grain size. Reverse Hall–Petch behavior was observed with no appreciable room temperature creep. Non-linear elasticity with small irreversible deformation was observed for 50 nm thick specimens.

[1]  C. Pande,et al.  Yield stress of fine grained materials , 1998 .

[2]  G. Palumbo,et al.  On the contribution of triple junctions to the structure and properties of nanocrystalline materials , 1990 .

[3]  A. A. Nazarov,et al.  Model for the prediction of the mechanical behaviour of nanocrystalline materials , 1993 .

[4]  Jeffrey Wadsworth,et al.  Hall-petch relation in nanocrystalline solids , 1991 .

[5]  E. Arzt.  Size effects in materials due to microstructural and dimensional constraints: a comparative review , 1998 .

[6]  A. Rosen,et al.  On the validity of the hall-petch relationship in nanocrystalline materials , 1989 .

[7]  B. Burton.  Diffusional Creep of Polycrystalline Materials , 1977 .

[8]  K. Lu,et al.  INTERFACE CONTROLLED DIFFUSIONAL CREEP OF NANOCRYSTALLINE PURE COPPER , 1999 .

[9]  M. A. Haque,et al.  In-situ tensile testing of nano-scale specimens in SEM and TEM , 2002 .

[10]  K. A. Padmanabhan,et al.  A model for the deformation of nanocrystalline materials , 1997 .

[11]  H. V. Swygenhoven,et al.  Microscopic description of plasticity in computer generated metallic nanophase samples: a comparison between Cu and Ni , 1999 .

[12]  Frans Spaepen,et al.  Tensile testing of free-standing Cu, Ag and Al thin films and Ag/Cu multilayers , 2000 .

[13]  R. Scattergood,et al.  A modified model for hall-petch behavior in nanocrystalline materials , 1992 .

[14]  K. Jacobsen,et al.  Softening of nanocrystalline metals at very small grain sizes , 1998, Nature.

[15]  P. Heino,et al.  Strength of nanoscale polycrystalline copper under shear , 2001 .

[16]  R. W. Hoffman,et al.  Tensile properties of aluminum/alumina multi-layered thin films , 1993 .