Three-Dimensional Finite Element Simulation of Electro and Stress Migration Effects in Interconnect Lines

A tool for 3-D modeling of EM and SM in interconnect lines has been developed based on a commercial finite element code. After detailing the approach, we focus on the verification of the simulator by comparing the results of 1-D analytic and FEM simulations, and then we apply the simulator to interconnect line segments with a specified grain structure.