Integrated Circuit Package Having An Inductance Loop Formed From A Multi-loop Configuration
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The integrated circuit package of the present invention includes the inductance loops formed in the connection of one or more input-output (I / O) package pins and lead wires (lead wires). In one silye, it said inductance loop is an integrated circuit on a first bonding pad (boding pad) the first and second lines and a second bonding on the chip for connecting the first input and output (I / O) pins of the package the pad is formed from the third and fourth lines connecting the second input and output (I / O) pins of the package (boding pad). To complete the loop, the inductor, the first and second input-output (I / O) pins are connected by a third conductor between the fins. The third conductor may include one or more bonding wires (bonding wires), preferably the input and output (I / O) pins are adjacent to each other. However, the loop is, for example, be formed from a loop length requirements, spatial considerations, and / or input-output (I / O) on the basis of other design or functional elements that are not adjacent connecting pins. In another embodiment, the connection between the first and second input-output (I / O) pins are implemented by making the input and output (I / O) pins with a single structure. In yet another embodiment, the connection between the first and second input-output (I / O) pins are implemented by a metal wiring layer located within the substrate as well as the surface of the package substrate. By forming the inductor loop within the limits of the integrated circuit package, according to the space requirements, the actual reduction is implemented, this will be promote other words, compact. In addition, the integrated circuit having at least one parameter to be controlled by the length of the inductor loop of the package, can be implemented in any type of modification of the system. Inductance loop, an integrated circuit package