Silicon Wafer Bonding Technology for VLSI and MEMS Applications
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Introduction S.S.Iyer 1 Wafer bonding principles Q.-Y. Tong 2 Bond, grind-back and polish SOI K.Mitani 3 Smart Cut: the technology for high volume SOI B.Aspar and A.J.Auberton-Herve 4 ELTRAN (SOI-Epi wafer) technology T.Yonehara 5 Wafer characterisation G.Pfeiffer and S.S.Iyer 6 Advanced applications of wafer bonding E.C.Jones and S.W.Bedell Appendix: A manufacturing process for silicon-on-silicon wafer bonding K.Bansal and J.P.Goodrich. Index