Modeling and characterization of polycrystalline-silicon thin-film transistors with a channel-length comparable to a grain size
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[1] K. Saraswat,et al. Controlled two-step solid-phase crystallization for high-performance polysilicon TFT's , 1997, IEEE Electron Device Letters.
[2] R. Hall. Electron-Hole Recombination in Germanium , 1952 .
[3] W. Read,et al. Statistics of the Recombinations of Holes and Electrons , 1952 .
[4] G. Fortunato,et al. Determination of gap state density in polycrystalline silicon by field‐effect conductance , 1986 .
[5] T. Ikoma,et al. Computer-aided analysis of GaAs n-i-n structures with a heavily compensated i-layer , 1986, IEEE Transactions on Electron Devices.
[6] M. Han,et al. Gate-overlapped lightly doped drain poly-Si thin-film transistors for large area-AMLCD , 1998 .
[7] T. Brown,et al. Investigation of the low field leakage current mechanism in polysilicon TFT's , 1998 .
[8] Stephen J. Fonash,et al. Polycrystalline silicon thin film transistors on Corning 7059 glass substrates using short time, low‐temperature processing , 1993 .
[9] Warren B. Jackson,et al. Density of gap states of silicon grain boundaries determined by optical absorption , 1983 .
[10] Ping Keung Ko,et al. Kink-free polycrystalline silicon double-gate elevated-channel thin-film transistors , 1998 .
[11] K. H. Lee,et al. A high-performance polycrystalline silicon thin film transistor with a silicon nitride gate insulator , 1998 .
[12] T. Sigmon,et al. High-performance thin-film transistors fabricated using excimer laser processing and grain engineering , 1998 .
[13] Hyun Jae Kim,et al. New excimer‐laser‐crystallization method for producing large‐grained and grain boundary‐location‐controlled Si films for thin film transistors , 1996 .
[14] S. Maeda,et al. A C-switch cell for low-voltage and high-density SRAMs , 1998 .
[15] K. Yamaguchi,et al. Two-dimensional numerical simulation of Fermi-level pinning phenomena due to DX centers in AlGaAs/GaAs HEMTs , 1989 .