Due to the requirements of on-line detection of grinding force in the grinding process, this paper utilizes the structural characteristics of ultra-precision grinder with double-spindle and single-workstation, and then presents a grinding dynamometer based on piezoelectric effect of quartz crystals. Besides, the grinder dynamometer can measure grinding force in three directions, and the static properties of dynamometer are experimentally tested in a special experiment table. Moreover, the on-line static calibration and the actual grinding experiment of dynamometer installed in the silicon wafer grinder are performed. The results indicate that the grinding dynamometer has satisfactory static properties, that is, the linearity and repeatability are less than 1%, and the cross-talks are also less than 5%. As a result, each indicator has full reached the operating requirements in using of large diameter silicon wafer grinding force measuring.
[1]
Renke Kang,et al.
Development of Ultra-Precision Grinder for 300mm Wafers
,
2012
.
[2]
R. Ryan Vallance,et al.
In-process force monitoring for precision grinding semiconductor silicon wafers
,
2005,
Int. J. Manuf. Technol. Manag..
[3]
Hans Kurt Tönshoff,et al.
Process Monitoring in Grinding
,
2002
.
[4]
Bo Liu,et al.
A Novel Piezoelectric Grinding Dynamometer for Monitoring Ultra-Precision Grinding of Silicon Wafers
,
2010
.
[5]
Zhijian Pei,et al.
Fine grinding of silicon wafers: designed experiments
,
2002
.