bibliography of liquid cooled heat sinks for thermal enhancement of electronic packages

A bibliography of 225 publications dealing with liquid cooled heat sinks for thermal enhancement of electronic packages is presented. The bibliography also includes papers dealing with design and performance analysis of heat sinks and extended surfaces cooled with liquids. The papers are arranged in several categories.

[1]  M. Hamdan,et al.  Enhanced Heat Transfer, Missing Pin, and Optimization for Cylindrical Pin Fin Arrays , 1993 .

[2]  Avram Bar-Cohen,et al.  Optimum Arrays of Longitudinal, Rectangular Fins in Corrective Heat Transfer , 1985 .

[3]  S. C. Lau,et al.  Conjugate heat transfer in channels with internal longitudinal fins , 1989 .

[4]  R. Jaeger,et al.  Optimal Sizing of Planar Thermal Spreaders , 1994 .

[5]  C. Y. Liu,et al.  Laminar flow through microchannels used for microscale cooling systems , 1997, Proceedings of the 1997 1st Electronic Packaging Technology Conference (Cat. No.97TH8307).

[6]  S. S. Kang,et al.  Impingement heat sinks for air cooled high power electronic modules , 1995 .

[7]  J. Lyman.  Supercomputers demand innovation in packaging and cooling , 1982 .

[8]  L. Mok,et al.  Thermal management of silicon-based multichip modules , 1994, Proceedings of 1994 IEEE/CHMT 10th Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM).

[9]  D. E. Metzger,et al.  Heat Transfer Experiments and Flow Visualization for Arrays of Short Pin Fins , 1982 .

[10]  M. Mahalingam.  Thermal management in semiconductor device packaging , 1985, Proceedings of the IEEE.

[11]  A. Bar-Cohen.  An Addendum and Correction to "Thermal Management of Air- and Liquid-Cooled Multichip Modules" , 1988 .

[12]  A. Aziz.  A graduate course in fin heat transfer , 1985 .

[13]  S. Bosworth,et al.  Exceptional performance from the development, qualification and implementation of a silicone adhesive for bonding heatsinks to semiconductor packages , 1994, 1994 Proceedings. 44th Electronic Components and Technology Conference.

[14]  L. J. Missaggia.  A microchannel heat sink with alternating directions of water flow in adjacent channels , 1992, Optics East.

[15]  Ephraim M Sparrow,et al.  Pressure Drop Characteristics for a Shrouded Longitudinal-Fin Array with Tip Clearance , 1981 .

[16]  Ephraim M Sparrow,et al.  NATURAL CONVECTION IN A VERTICAL CHANNEL: I. INTERACTING CONVECTION AND RADIATION. II. THE VERTICAL PLATE WITH AND WITHOUT SHROUDING , 1980 .

[17]  S. Liaw,et al.  Optimum configuration of a fin for boiling heat transfer , 1993 .

[18]  N. M. Schnurr.  Radiation from an Array of Longitudinal Fins of Triangular Profile , 1975 .

[19]  G. Lehmann,et al.  A Study of Forced Convection Direct Air Cooling in the Downstream Vicinity of Heat Sinks , 1990 .

[20]  Frank P. Incropera,et al.  Convection heat transfer in electronic equipment cooling , 1988 .

[21]  B. T. Chao,et al.  Mass minimization of radiating trapezoidal fins with negligible base cylinder interaction , 1963 .

[22]  S D Probert,et al.  Natural-Convective Heat Exchanger with Vertical Rectangular Fins and Base: Design Criteria , 1987 .

[23]  S. C. Arora,et al.  Heat Transfer Experiments in High Aspect Ratio Rectangular Channel With Epoxied Short Pin Fins , 1983 .

[24]  A. Batchelor.  Heat sink analysis for two-terminal cylindrical microwave oscillator devices , 1994 .

[25]  S. Hamilton.  A New Adhesive System for Heat Sink Bonding , 1991 .

[26]  Adrian Bejan,et al.  Heat sinks with sloped plate fins in natural and forced convection , 1996 .

[27]  J. P. Bronson,et al.  Developing Heat Transfer in Rectangular Ducts With Staggered Arrays of Short Pin Fins , 1982 .

[28]  P. Razelos,et al.  The optimization of longitudinal convective fins with internal heat generation , 1979 .

[29]  Ephraim M Sparrow,et al.  Effect of a missing cylinder on heat transfer and fluid flow in an array of cylinders in cross-flow , 1982 .

[30]  D. M. Mills,et al.  High performance microchannel heat exchanger for cooling high heat load x-ray optical elements , 1992 .

[31]  Earl R. Barnes.  A variational problem arising in the design of cooling fins , 1976 .

[32]  Michael Pecht,et al.  Component Placement for Reliability on Conductively Cooled Printed Wiring Boards , 1989 .

[33]  W. Rohsenow,et al.  Thermally Optimum Arrays of Cards and Fins in Natural Convection , 1983 .

[34]  Darryl E. Metzger,et al.  Developing heat transfer in rectangular ducts with arrays of short pin fins , 1981 .

[35]  HEAT TRANSFER IN SLENDER FINS USING BOUNDARY INTEGRAL EQUATION ANALYSIS , 1991 .

[36]  Abdul Aziz,et al.  Optimization of rectangular and triangular fins with convective boundary condition , 1985 .

[37]  APPLICATIONS OF FOURIER SERIES TECHNIQUE TO TRANSIENT HEAT TRANSFER PROBLEM , 1982 .

[38]  H. Barrow.  Theoretical solution for the temperature in a straight fin with variable surface heat transfer coefficient , 1986 .

[39]  A. Razani,et al.  Optimization of convective fin with temperature-dependent thermal parameters , 1993 .

[40]  G. Tanda,et al.  Effect of Shrouding on Air Natural-Convection Heat Transfer from Staggered Vertical Fins , 1989 .

[41]  Ralph L. Webb,et al.  Heat transfer and friction in the offset stripfin heat exchanger , 1987 .

[42]  M. Avrami,et al.  Diffusion of Heat Through a Rectangular Bar and the Cooling and Insulating Effect of Fins. I. The Steady State , 1942 .

[43]  Leroy S. Fletcher,et al.  The Effect of Plate Spacing on Free Convection Between Heated Parallel Plates , 1992 .

[44]  G. J. Vanfossen.  Heat transfer coefficients for staggered arrays of short pin fins , 1981 .

[45]  Derek B. Ingham,et al.  The Effects of Nonuniform Heat Transfer from an Annular Fin of Triangular Profile , 1981 .

[46]  J. Ernest Wilkins,et al.  Minimizing the Mass of Thin Radiating Fins , 1960 .

[47]  M. H. Cobble,et al.  Optimum fin shape , 1971 .

[48]  V. Garg,et al.  Heat transfer from a cylindrical fin in combined free-forced flow , 1988 .

[49]  Seri Lee.  Optimum design and selection of heat sinks , 1995 .

[50]  Ephraim M Sparrow,et al.  Heat-transfer, pressure-drop and performance relationships for in-line, staggered, and continuous plate heat exchangers , 1979 .

[51]  T.D. Yuan.  Thermal performance characteristic comparison between flip-chip wirebond ceramic multichip modules , 1996, Proceedings 1996 IEEE Multi-Chip Module Conference (Cat. No.96CH35893).

[52]  H. Barrow.  A note on frosting of heat pump evaporator surfaces , 1985 .

[53]  Y. Kaneko,et al.  Air Cooling Of Mcms Mounted On Card-on- Board Packaging Systems , 1993, Proceedings of Japan International Electronic Manufacturing Technology Symposium.

[54]  F. Lai,et al.  Temperature distribution in a fin partially cooled by nucleate boiling , 1967 .

[55]  H. Ünal.  Determination of the temperature distribution in an extended surface with a non-uniform heat transfer coefficient , 1985 .

[56]  Ephraim M Sparrow,et al.  Radiant interaction between fin and base surfaces , 1962 .

[57]  A. D. Kraus.  Analysis of Extended Surface Arrays for Air-Cooled Electronic Equipment , 1994 .

[58]  D. R. Mullen,et al.  The design of a reduced ambient temperature, air cooled supercomputer , 1988, Proceedings 1988 IEEE International Conference on Computer Design: VLSI.

[59]  N. V. Suryanarayana.  Two-Dimensional Effects on Heat Transfer Rates From an Array of Straight Fins , 1977 .

[60]  J. Armstrong,et al.  A Review of Staggered Array Pin Fin Heat Transfer for Turbine Cooling Applications , 1987 .

[61]  J. Westwater,et al.  Heat transfer from multiple spines to boiling liquids , 1971 .

[62]  M. J. Shilston,et al.  Heat transfer performances of vertical rectangular fins protruding from rectangular bases: Effect of fin length , 1986 .

[63]  Theodore J. Heindel,et al.  Enhancement of natural convection heat transfer from an array of discrete heat sources , 1996 .

[64]  F. Lien,et al.  Radiative effect on the conjugated forced convection-conduction analysis of heat transfer in a plate fin , 1985 .

[65]  P. Razelos.  The Quest for the Optimum Longitudinal Fin Profile , 1995 .

[66]  Yao Peng,et al.  Heat Transfer and Friction Loss Characteristics of Pin Fin Cooling Configurations , 1984 .

[67]  W. Lau,et al.  Errors in One-Dimensional Heat Transfer Analysis in Straight and Annular Fins , 1973 .

[68]  A. Aziz,et al.  Two-dimensional performance of convecting-radiating fins of different profile shapes , 1993 .

[69]  Hitoshi Matsushima,et al.  Finite Element Analysis of LSI Packages with Three-Dimensional Steady Heat Transfer and Fluid Flow by the SIMPLE Algorithm Formulation. , 1994 .

[70]  Ephraim M Sparrow,et al.  Numerical and experimental study of turbulent heat transfer and fluid flow in longitudinal fin arrays , 1986 .

[71]  Anthony F. Bernhardt,et al.  Microchannel heatsink with liquid-nitrogen cooling , 1993, Optics & Photonics.

[72]  R. B. Praught.  Inclined Fins for a More Efficient Heat Sink , 1982, INTELEC '82 - International Telecommunications Energy Conference.

[73]  P. B. Wesling.  Thermal characterization of a 149-lead VLSI package with heat sink , 1988, Fourth Annual IEEE Semiconductor Thermal and Temperature Measurement Symposium.

[74]  H. Tramposch.  Optimum Design of Medium-Power Transistor Heat Sinks , 1963 .

[75]  J. Donnelly,et al.  Hybrid approach to two-dimensional surface-emitting diode laser arrays , 1988 .

[76]  W. I. Johnson,et al.  Combined effects of sub-cooling and operating pressure on the performance of a two-chamber thermosyphon , 1998, ITherm'98. Sixth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.98CH36208).

[77]  E. Sparrow,et al.  A Natural Convection Fin with a Solution-Determined Nonmonotonically Varying Heat Transfer Coefficient , 1981 .

[78]  William C. Reynolds,et al.  A Design-Oriented Optimization of Simple Tapered Radiating Fins , 1963 .

[79]  Tien-Yu Tom Lee,et al.  Thermal evaluation of a PowerPC 620 multi-processor computer , 1996, Twelfth Annual IEEE Semiconductor Thermal Measurement and Management Symposium. Proceedings.

[80]  B. Gromoll,et al.  Advanced micro air-cooling systems for high density packaging , 1994, Proceedings of 1994 IEEE/CHMT 10th Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM).

[81]  S. Rooke,et al.  Transient analysis of extended surfaces with convective tip , 1994 .

[82]  D. Mundinger,et al.  Laser Diode Cooling For High Average Power Applications , 1989, Photonics West - Lasers and Applications in Science and Engineering.

[83]  T. Yuan.  Thermal modelling of integrated heat exchangers with alternating ribs , 1992, [1992 Proceedings] Intersociety Conference on Thermal Phenomena in Electronic Systems.

[84]  Avram Bar-Cohen.  State-of-the-Art and Trends in the Thermal Packaging of Electronic Equipment , 1992 .

[85]  I. Mudawar,et al.  Two-Phase Electronic Cooling Using Mini-Channel and Micro-Channel Heat Sinks: Part 2—Flow Rate and Pressure Drop Constraints , 1994 .

[86]  A. B. Duncan,et al.  Review of Microscale Heat Transfer , 1994 .

[87]  R. M. Cotta,et al.  Error Analysis and Improved Formulations for Extended Surfaces , 1994 .

[88]  L. D. Russell,et al.  Analytical solution for transient flow of energy in a one-dimensional radiating fin. , 1968 .

[89]  Shigenao Maruyama,et al.  Free convective/radiative heat transfer from pin-fin arrays with a vertical base plate (general representation of heat transfer performance) , 1990 .

[90]  J. W. Ramsey,et al.  Experiments on In-line Pin Fin Arrays and Performance Comparisons with Staggered Arrays , 1980 .

[91]  R. L. Mahajan,et al.  Convective Heat Transfer From Longitudinal Fin Arrays in the Entry Region of Turbulent Flow , 1989 .

[92]  Y. G. Tsuei,et al.  Two-dimensional rectangular fin with variable heat transfer coefficient , 1991 .

[93]  Chen-Ya Liu.  A Variational Problem with Applications to Cooling Fins , 1962 .

[94]  N. M. Schnurr,et al.  Radiation from an Array of Gray Circular Fins of Trapezoidal Profile , 1974 .

[95]  Raymond J. Beach,et al.  High average powers diode pumped slab laser , 1992 .

[96]  A. Snider.  Reply: The Quest for the Optimum Longitudinal Fin Profile , 1995 .

[97]  S. Macomber,et al.  Two-dimensional surface emitting distributed feedback laser arrays , 1989, IEEE Photonics Technology Letters.

[98]  Avram Bar-Cohen,et al.  High heat from a small package , 1986 .

[99]  J. W. Yang.  Periodic Heat Transfer in Straight Fins , 1972 .

[100]  P. L. Cane.  Heat Plates, Ladders and Sinks by Photochemical Milling , 1983 .

[101]  R. L. Linton,et al.  Coarse and detailed CFD modelling of a finned heat sink , 1994 .

[102]  R. Duffin,et al.  A Variational Problem Relating to Cooling Fins , 1959 .

[103]  W. Little,et al.  Measurement of friction factors for the flow of gases in very fine channels used for microminiature Joule-Thomson refrigerators , 1983 .

[104]  S. Sommerfeldt,et al.  High performance micro-channel air cooling , 1990, Sixth Annual IEEE Proceedings Semiconductor Thermal and Temperature Measurement Symposium.

[105]  Dennis J. Herrell,et al.  High performance air cooled heat sinks for integrated circuits , 1990 .

[106]  J. Westwater,et al.  Approximate Optimum Fin Design for Boiling Heat Transfer , 1971 .

[107]  K.G.T. Hollands,et al.  Natural Convection Heat Transfer From Arrays of Isothermal Triangular Fins in Air , 1994 .

[108]  M. J. Shilston,et al.  Forced-convective steady-state heat transfers from shrouded vertical fin arrays, aligned parallel to an undisturbed air-stream , 1987 .

[109]  R. Webb,et al.  Prediction of the friction factor for the offset strip-fin matrix , 1983 .

[110]  Micheal J. Morgan,et al.  Comparison of high heat flux cooling applications , 1993, Optics & Photonics.

[111]  C. Lombard.  Heat-Transfer for Fins with Two-Port Theory , 1996 .

[112]  A. Campo,et al.  Optimum Rectangular Radiative Fins Having Temperature- Variant Properties , 1973 .

[113]  H. Kalman,et al.  The effect of tip convection on the performance and optimum dimensions of cooling fins , 1992 .

[114]  Adrian Bejan,et al.  Optimal Arrays of Pin Fins and Plate Fins in Laminar Forced Convection , 1993 .

[115]  Toshio Aihara,et al.  Natural Convection Heat Transfer from Vertical Rectangular-Fin Arrays : Part 4, Heat-Transfer Characteristics of Nonisothermal-Fin Arrays , 1970 .

[116]  R.J. Schnipke,et al.  A fluid flow and heat transfer analysis for evaluating the effectiveness of an IC package heat sink , 1989, Fifth Annual IEEE Semiconductor Thermal and Temperature Measurement Symposium.

[117]  M. Ishizuka,et al.  Thermal studies of finned LSI packages under forced convection , 1989, Fifth Annual IEEE Semiconductor Thermal and Temperature Measurement Symposium.

[118]  Sushil H. Bhavnani,et al.  An Integral Heat Sink for Cooling Microelectronic Components , 1993 .

[119]  L. F. A. Azevedo,et al.  Vertical-channel natural convection spanning between the fully-developed limit and the single-plate boundary-layer limit , 1985 .

[120]  E. Sparrow,et al.  Heat transfer adjacent to the attached end of a cylinder in crossflow , 1984 .

[121]  Avram Bar-Cohen.  Thermal management of high-power microelectronic components: state of the art and future challenges , 1993, Optics & Photonics.

[122]  A. D. Kraus.  Analysis of Extended Surface , 1988 .

[123]  R. Cross.  Synergistic Combinations of Thermally Conductive Fillers in Polymer Matrices , 1996 .

[124]  N. K. Sane,et al.  NATURAL CONVECTION HEAT TRANSFER FROM HORIZONTAL RECTANGULAR FIN ARRAYS , 1974 .

[125]  Ephraim M Sparrow,et al.  Heat transfer and pressure drop for a staggered wall-attached array of cylinders with tip clearance , 1978 .

[126]  John U. Knickerbocker,et al.  IBM System/390 air-cooled alumina thermal conduction module , 1991, IBM J. Res. Dev..

[127]  W. Y. Chen,et al.  A thermal characteristic study of extruded-type heat sinks in considering air flow bypass phenomenon , 1990, Sixth Annual IEEE Proceedings Semiconductor Thermal and Temperature Measurement Symposium.

[128]  Arthur David Snider,et al.  An Efficient Algorithm for Evaluating Arrays of Extended Surface , 1978 .

[129]  D. Gerke,et al.  A hi-density C4/CBGA interconnect technology for a CMOS microprocessor , 1994 .

[130]  D. W. Van de Pol,et al.  Free Convection Heat Transfer from Vertical Fin-Arrays , 1974 .

[131]  T. Takeyama,et al.  Analysis of boiling heat transfer on a fin , 1973 .

[132]  Tsorng-Dih Yuan.  Computational modelling of flow bypass effects on straight fin heat sink in rectangular duct , 1996, Twelfth Annual IEEE Semiconductor Thermal Measurement and Management Symposium. Proceedings.

[133]  J. Beck,et al.  Maximum Temperatures in Diamond Heat Spreaders Using the Surface Element Method , 1993 .

[134]  N. V. Suryanarayana.  Transient Response of Straight Fins: Part II , 1976 .

[135]  Roy W. Knight,et al.  Optimal Thermal Design of Forced Convection Heat Sinks-Analytical , 1991 .

[136]  Jay N. Zemel,et al.  Liquid Transport In Micron And Submicron Channels , 1989, Optics & Photonics.

[137]  浩哉 水上,et al.  矩形配列ピンフィン群の伝熱特性 : 第1報, ピンピッチの影響 , 1993 .

[138]  L BrodskyW,et al.  LPCC(リード線付きプラスチック・チップ・基板)の信頼性と応用 , 1981 .

[139]  G. Tupholme,et al.  Steady-state heat transfer through extended plane surfaces , 1995 .

[140]  Gerd Linder,et al.  Manufacturing and testing of compact micro heat exchangers with high volumetric heat transfer coefficients , 1991 .

[141]  Adrian Bejan,et al.  Forced convection in banks of inclined cylinders at low Reynolds numbers , 1994 .

[142]  Arsalan Razani,et al.  Optimum dimensions of convective- radiative spines using a temperature correlated profile , 1991 .

[143]  A. Mertol.  Thermal performance comparison of high pin count cavity-up enhanced plastic ball grid array (EPBGA) packages , 1996 .

[144]  G. J. Vanfossen,et al.  Effect of Location in an Array on Heat Transfer to a Short Cylinder in Crossflow , 1984 .

[145]  P. Razelos,et al.  The Optimum Dimensions of Circular Fins with Variable Thermal Parameters , 1979 .

[146]  S. Kitajo,et al.  Development of a high performance air cooled heat sink for multi-chip modules , 1992, [1992 Proceedings] Eighth Annual IEEE Semiconductor Thermal Measurement and Management Symposium.

[147]  A. T. Morrison,et al.  Optimization of heat sink fin geometries for heat sinks in natural convection , 1992, [1992 Proceedings] Intersociety Conference on Thermal Phenomena in Electronic Systems.

[148]  J. W. Westwater,et al.  Heat transfer from a fin to a boiling liquid , 1965 .

[149]  A. Bar-Cohen,et al.  Immersion Cooling of Digital Computers , 1994 .

[150]  E. Sasaki,et al.  Gas Cooling Enhancement Technology for Integrated Circuit Chips , 1984 .

[151]  M. Ishizuka,et al.  Small cooling fin performances for LSI packages. , 1987 .

[152]  Mihaela Morega,et al.  Plate fins with variable thickness and height for air-cooled electronic modules , 1994 .

[153]  Albert T. Macrander,et al.  Thermal, structural, and diffraction analysis of a gallium-cooled x-ray monochromator , 1993, Optics & Photonics.

[154]  Issam Mudawar,et al.  Two-Phase Electronic Cooling Using Mini-Channel and Micro-Channel Heat Sinks: Part 1—Design Criteria and Heat Diffusion Constraints , 1994 .

[155]  Ephraim M Sparrow,et al.  Performance comparisons among geometrically different pin-fin arrays situated in an oncoming longitudinal flow , 1982 .

[156]  R. Karvinen.  Efficiency of straight fins cooled by natural or forced convection , 1983 .

[157]  Fabricating rectangular internal cooling channels in silicon x‐ray monochromator optics , 1989 .

[158]  B. Sundén.  Conjugate mixed convection heat transfer from a vertical rectangular fin , 1983 .

[159]  E. Sparrow,et al.  Heat transfer in a tube bank in the presence of upstream cross-sectional enlargement , 1983 .

[160]  K. N. Seetharamu,et al.  Experimental analysis of unsteady free convection heat transfer from horizontal fin arrays , 1989 .

[161]  Avram Bar-Cohen,et al.  Optimum Cylindrical Pin Fin , 1981 .

[162]  D. E. Metzger,et al.  PRESSURE LOSS AND HEAT TRANSFER THROUGH MULTIPLE ROWS OF SHORT PIN FINS , 1982 .

[163]  J. R. Parsons,et al.  A Preliminary Investigation of the Cooling of Electronic Components With Flat Plate Heat Sinks , 1994 .

[164]  Chen-Ya Liu.  A VARIATIONAL PROBLEM RELATING TO COOLING FINS WITH HEAT GENERATION , 1961 .

[165]  Nancy D. Fitzroy,et al.  Optimum Spacing of Fins Cooled by Free Convection , 1971 .

[166]  A. Aziz,et al.  Analytical and numerical modeling of steady periodic heat transfer in extended surfaces , 1994 .

[167]  A. Reisman,et al.  A thermal module design for advanced packaging , 1987 .

[168]  Masaru Ishizuka,et al.  Cooling performance of plate fins for multichip modules , 1994, Proceedings of 1994 4th Intersociety Conference on Thermal Phenomena in Electronic Systems (I-THERM).

[169]  Solution of some boundary problems of heat conduction for cylindrical bodies provided with longitudinal fins , 1967 .

[170]  A. Aziz,et al.  Heat transfer from convecting-radiating fins of different profile shapes , 1992 .

[171]  M. Kohara,et al.  Development of a new air-cooling heatsink for a high density computer system , 1990, 40th Conference Proceedings on Electronic Components and Technology.

[172]  D. Copeland.  Single-Phase and Boiling Cooling of Small Pin Fin Arrays by Multiple Nozzle Jet Impingement , 1996 .

[173]  Suhas V. Patankar,et al.  Influence of buoyancy on the vertical flow and heat transfer in a shrouded fin array , 1984 .

[174]  Ramesh K. Shah,et al.  Assessment of calculation methods for efficiency of straight fins of rectangular profile , 1992 .

[175]  T. Ishikawa,et al.  Performance of a directly water‐cooled silicon crystal for use in high‐power synchrotron radiation applications , 1989 .

[176]  Dino R. Ciarlo,et al.  High average power edge emitting laser diode arrays on silicon microchannel coolers , 1990 .

[177]  Wataru Nakayama,et al.  Thermal Management of Electronic Equipment: A Review of Technology and Research Topics , 1986 .

[178]  Y Yokono,et al.  Numerical simulation for thermal resistance of finned LSI packages. , 1993 .

[179]  M. Davies,et al.  Measurements of air velocity and temperature around three rectangular naturally convecting fin arrays , 1994, Proceedings of 1994 4th Intersociety Conference on Thermal Phenomena in Electronic Systems (I-THERM).

[180]  G. J. Vanfossen,et al.  Length to diameter ratio and row number effects in short pin fin heat transfer , 1984 .

[181]  Roy W. Knight,et al.  Optimal thermal design of air cooled forced convection finned heat sinks-experimental verification , 1992 .

[182]  M. J. Shilston,et al.  Heat exchanger design: Optimal uniform separation between rectangular fins protruding from a vertical rectangular base , 1985 .

[183]  Sadanari Mochizuki,et al.  TRANSPORT PHENOMENA IN STACKS OF INTERRUPTED PARALLEL-PLATE SURFACES , 1987 .

[184]  Robert A. Riddle.  Thermal stresses in the microchannel heatsink cooled by liquid nitrogen , 1993, Optics & Photonics.

[185]  J. F. Osterle,et al.  The Development of Free Convection Between Heated Vertical Plates , 1962 .

[186]  Myron Levitsky,et al.  The criterion for validity of the fin approximation , 1972 .

[187]  K. Azar,et al.  Narrow channel heat sink for cooling of high powered electronic components , 1992, [1992 Proceedings] Eighth Annual IEEE Semiconductor Thermal Measurement and Management Symposium.

[188]  R. Keyes.  Heat transfer in forced convection through fins , 1984, IEEE Transactions on Electron Devices.

[189]  Ephraim M Sparrow,et al.  Effect of tip-to-shroud clearance on turbulent heat transfer from a shrouded, longitudinal fin array , 1986 .

[190]  The Cooling of Electronic Components with Flat Plate Heat Sinks , 1994 .

[191]  A. Aziz,et al.  Perturbation Solution for Convecting Fin With Variable Thermal Conductivity , 1975 .

[192]  Ephraim M Sparrow,et al.  Forced Convection Heat Transfer from a Shrouded Fin Array with and without Tip Clearance , 1978 .

[193]  Avram Bar-Cohen,et al.  Thermal management of electronic components with dielectric liquids , 1993 .

[194]  R. Beach,et al.  Demonstration of high‐performance silicon microchannel heat exchangers for laser diode array cooling , 1988 .

[195]  Theoretical Analysis for a New Package Concept: High-Speed Heat Removal for VLSI Using an AlN Heat-Spreading Layer and Microchannel Fin , 1991 .

[196]  W. Elenbaas.  Heat dissipation of parallel plates by free convection , 1942 .

[197]  V. Samalam.  Convective heat transfer in microchannels , 1989 .

[198]  N. Epstein,et al.  EFFECT OF UNIFORM FOULING DEPOSIT ON TOTAL EFFICIENCY OF EXTENDED HEAT TRANSFER SURFACES , 1978 .

[199]  G. Peterson,et al.  Convective heat transfer and flow friction for water flow in microchannel structures , 1996 .

[200]  Derek B. Ingham,et al.  The Analysis of Fin Assembly Heat Transfer by a Series Truncation Method , 1982 .

[201]  J. Wilkins,et al.  Minumum-Mass Thin Fins which Transfer Heat Only by Radiation to Surroundings at Absolute Zero , 1960 .

[202]  E. V. Somers,et al.  RADIATION FIN EFFICIENCY FOR ONE-DIMENSIONAL HEAT FLOW IN A CIRCULAR FIN , 1959 .

[203]  E. Sparrow,et al.  Measurements of heat transfer and pressure drop for an array of staggered plates aligned parallel to an air flow , 1980 .

[204]  J. E. Myers,et al.  Transport from extended surfaces , 1964 .

[205]  S. Probert,et al.  Thermal resistances of pressed contacts , 1986 .

[206]  X. Peng,et al.  Experimental investigation on liquid forced-convection heat transfer through microchannels☆ , 1994 .

[207]  A. Sen,et al.  An Exact Solution for the Rate of Heat Transfer From a Rectangular Fin Governed by a Power Law–Type Temperature Dependence , 1986 .

[208]  Charles Dingee Jones,et al.  Optimum Arrangement of Rectangular Fins on Horizontal Surfaces for Free-Convection Heat Transfer , 1970 .

[209]  S. K. Roy,et al.  A very high heat flux microchannel heat exchanger for cooling of semiconductor laser diode arrays , 1996 .

[210]  N. F. Raley,et al.  Multichip packaging for very-high-speed digital systems , 1990 .

[211]  F. K. King,et al.  Design and Fabrication of Heat Transfer Surfaces from Superplastic Material , 1972, IBM J. Res. Dev..

[212]  W. B. Joyce,et al.  Thermal resistance of heat sinks with temperature-dependent conductivity , 1975 .

[213]  P. Seleghim,et al.  Comparison of heat transfer correlations for single- and two-phase microchannel flows for microelectronics cooling , 1998, ITherm'98. Sixth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.98CH36208).

[214]  E. Sparrow,et al.  Heat-transfer characteristics of polygonal and plate fins , 1964 .

[215]  Frank P. Incropera,et al.  ENHANCEMENT OF CONVECTIVE HEAT TRANSFER FROM SMALL HEAT SOURCES TO LIQUID COOLANTS USING STRIP FINS , 1987 .

[216]  William F. Washburn,et al.  IBM Enterprise System/9000 Type 9121 Model 320 air-cooled processor technology , 1991, IBM J. Res. Dev..

[217]  Matthew John M. Krane.  Constriction Resistance in Rectangular Bodies , 1991 .

[218]  A. Bejan,et al.  Ernst Schmidt's approach to fin optimization: an extension to fins with variable conductivity and the design of ducts for fluid flow , 1988 .

[219]  A. Brown,et al.  OPTIMUM DIMENSIONS OF UNIFORM ANNULAR FINS , 1965 .

[220]  G. Peterson,et al.  The effect of thermofluid and geometrical parameters on convection of liquids through rectangular microchannels , 1995 .

[221]  G. M. Harpole,et al.  Micro-channel heat exchanger optimization , 1991, 1991 Proceedings, Seventh IEEE Semiconductor Thermal Measurement and Management Symposium.

[222]  B. Sundén.  The effect of prandtl number on conjugate heat transfer from rectangular fins , 1985 .

[223]  R. Schmidt,et al.  Heat Transfer From an Asymmetrically Heated Channel Partially Enclosing a Rotating Disk , 1995 .

[224]  T. Na,et al.  STEADY PERIODIC HEAT TRANSFER IN FINS OF ARBITRARY PROFILE , 1980 .

[225]  J. P. Krusius,et al.  Package thermal resistance: geometrical effects in conventional and hybrid packages , 1990 .

[226]  G. Peterson,et al.  Experimental investigation of heat transfer in flat plates with rectangular microchannels , 1995 .

[227]  D. Ingham,et al.  The One-Dimensional Analysis of Fin Assembly Heat Transfer , 1983 .

[228]  D. Look.  Separation of variables on a triangular geometry , 1992 .

[229]  D. Metzger,et al.  Effects of Pin Shape and Array Orientation on Heat Transfer and Pressure Loss in Pin Fin Arrays , 1984 .

[230]  M. B. Parekh,et al.  A Compact High Intensity Cooler (CHIC) , 1983 .

[231]  D. A. Kaminski,et al.  Natural Convection and Radiation Heat Transfer From an Array of Inclined Pin Fins , 1989 .

[232]  E. Schmitt,et al.  Microchannel water cooling of silicon x‐ray monochromator crystals , 1992 .

[233]  G. Theoclitus.  Heat-Transfer and Flow-Friction Characteristics of Nine Pin-Fin Surfaces , 1966 .

[234]  D. Copeland,et al.  Manifold Microchannel Heat Sinks : Theory and Experiment , 1995 .

[235]  Hans Eder.  Dimensioning of fins with general nonlinear cooling laws , 1973 .

[236]  Suhas V. Patankar,et al.  Numerical Prediction of Heat Transfer and Fluid Flow in Rectangular Offset-Fin Arrays , 1989 .

[237]  A. Kraus,et al.  Transient Heat Transfer in Extended Surfaces , 1995 .

[238]  R. Fabian Pease,et al.  Physical limits to the useful packaging density of electronic systems , 1988 .

[239]  Sushil H. Bhavnani,et al.  Towards optimizing enhanced surfaces for passive immersion cooled heat sinks , 1998, ITherm'98. Sixth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.98CH36208).

[240]  C. J. Maday,et al.  The Minimum Weight One-Dimensional Straight Cooling Fin , 1974 .

[241]  Hiroshi Murano,et al.  Packaging technology for the NEC SX-3 supercomputers , 1985 .

[242]  Raymond J. Beach,et al.  High‐reliability silicon microchannel submount for high average power laser diode arrays , 1990 .

[243]  B. H. Chen,et al.  Performance-evaluation criteria for enhanced heat-transfer surfaces , 1988 .

[244]  R. Kilburn,et al.  Evaluation of surface heat transfer coefficients for electronic module packages , 1981 .

[245]  G. B. Kromann.  Thermal management of a C4/ceramic-ball-grid array: the Motorola PowerPC 603/sup TM/ and PowerPC 604/sup TM/ RISC microprocessors , 1996, Twelfth Annual IEEE Semiconductor Thermal Measurement and Management Symposium. Proceedings.

[246]  R. L. Mahajan,et al.  Effects of tip clearance and fin density on the performance of heat sinks for VLSI packages , 1989 .

[247]  D. Bondurant.  Performance of Transverse Fins for Boiling Heat Transfer , 1970 .

[248]  A. Zukauskas.  Heat Transfer from Tubes in Crossflow , 1972 .

[249]  範行 芦分,et al.  発熱素子冷却用のマルチフィン形熱伝導体に関する研究 : 第2報, 発熱素子と熱伝導体間の接触熱抵抗の予測方法 , 1992 .

[250]  S. Sommerfeldt,et al.  Thermal performance of an integral immersion cooled multichip module package , 1993, [1993 Proceedings] Ninth Annual IEEE Semiconductor Thermal Measurement and Management Symposium.

[251]  M. Yovanovich,et al.  Simplified solutions to circular annular fins with contact resistance and end cooling , 1988 .

[252]  A. Tolpadi,et al.  Similarity solution for conjugate natural convection heat transfer from a long vertical plate fin , 1983 .

[253]  A. Aziz,et al.  Perturbation analysis for periodic heat transfer in radiating fins , 1981 .

[254]  A. Bejan,et al.  The optimal spacing of parallel plates cooled by forced convection , 1992 .

[255]  M. Chang,et al.  Optimum longitudinal convective fin arrays , 1995 .

[256]  W. Rohsenow,et al.  Thermally Optimum Spacing of Vertical, Natural Convection Cooled, Parallel Plates , 1984 .

[257]  M. J. Shilston,et al.  Heat exchanger: Optimal separation for vertical rectangular fins protruding from a vertical rectangular base , 1985 .

[258]  Kenneth E. Goodson,et al.  Improved heat sinking for laser-diode arrays using microchannels in CVD diamond , 1997 .

[259]  Thermal Coupling of Equipment by Interleaving Fins , 1970 .

[260]  I. Mudawar,et al.  Enhancement of Critical Heat Flux From High Power Microelectronic Heat Sources in a Flow Channel , 1990 .

[261]  J. Sucec,et al.  Efficiency of Circular Fins of Triangular Profile , 1969 .

[262]  Ju Yi-Hsu,et al.  A new approach to the transient conduction in a 2-D rectangular fin , 1989 .

[263]  Arthur David Snider,et al.  The Quest for the Optimum Longitudinal Fin Profile , 1987 .

[264]  J. R. Rujano,et al.  Analysis and computation of conjugate heat transfer in trapezoidal microchannel heat sinks in a silicon substrate , 1995 .

[265]  G. Kroman.  Thermal management of a C4/CBGA interconnect technology for a high-performance RISC microprocessor: the Motorola PowerPC 620/sup TM/ microprocessor , 1996, 1996 Proceedings 46th Electronic Components and Technology Conference.

[266]  T. Bott.  Gas Side Fouling , 1988 .

[267]  E. M. Flynn.  Evaluation of Cooling Concepts for High Power Avionics Applications , 1992 .

[268]  Roger R. Schmidt,et al.  System cooling design for the water-cooled IBM Enterprise System/9000 processors , 1992, IBM J. Res. Dev..

[269]  Chung-Hsiung Li.  Optimum cylindrical pin fin , 1983 .

[270]  S. Kuehn,et al.  High performance air cooling scheme using ducted microchannel parallel plate-fin heat sinks , 1995, Proceedings of 1995 IEEE/CPMT 11th Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM).

[271]  M. Mobedi,et al.  Natural Convection Heat Transfer from Horizontal Rectangular Fin Arrays , 1994 .

[272]  Herbert Reichl,et al.  High power multichip modules employing the planar embedding technique and microchannel water heat sinks , 1997, Thirteenth Annual IEEE. Semiconductor Thermal Measurement and Management Symposium.

[273]  C. J. Maday,et al.  A Least Weight Circular Cooling Fin , 1975 .

[274]  Haim Kalman,et al.  Efficiency and optimized dimensions of annular fins of different cross-section shapes , 1989 .

[276]  Analysis and Optimization of Convective Trapezoidal Profile Longitudinal Fins , 1993 .

[277]  R. M. Cotta,et al.  Improved One-Dimensional Fin Solutions , 1990 .

[278]  Ephraim M Sparrow,et al.  Longitudinally-finned cross-flow tube banks and their heat transfer and pressure drop characteristics , 1985 .

[279]  T. Ohsaki,et al.  A new multi-chip module using a copper polyimide multi-layer substrate , 1989 .

[280]  Ephraim M Sparrow,et al.  Heat Transfer by Natural Convection From an Array of Short, Wall-Attached Horizontal Cylinders , 1982 .

[281]  W. Zhimin,et al.  The optimum thermal design of microchannel heat sinks , 1997, Proceedings of the 1997 1st Electronic Packaging Technology Conference (Cat. No.97TH8307).

[282]  Dwight C. Look.  Two-Dimensional Fin Performance: Bi (top surface) ≥ Bi (bottom surface) , 1988 .

[283]  Fujii Masao,et al.  Heat transfer and pressure drop of perforated surface heat exchanger with passage enlargement and contraction , 1988 .

[284]  D. Tuckerman.  Heat-transfer microstructures for integrated circuits , 1984 .

[285]  Ephraim M Sparrow,et al.  Natural Convection/Radiation Heat Transfer From Highly Populated Pin Fin Arrays , 1985 .

[286]  Arthur David Snider,et al.  A General Extended Surface Analysis Method , 1981 .

[287]  A. R. Wieting,et al.  Empirical correlations for heat transfer and flow friction characteristics of rectangular offset-fin plate-fin heat exchangers , 1975 .

[288]  Ephraim M Sparrow,et al.  Heat transfer from pin-fins situated in an oncoming longitudinal flow which turns to crossflow , 1982 .

[289]  K. N. Seetharamu,et al.  Experimental studies on steady free convection heat transfer from fins and fin arrays , 1990 .

[290]  M. Ishizuka,et al.  Thermal studies on finned LSI packages using forced convection , 1989 .

[291]  AN ASYMPTOTIC INTEGRAL EQUATION METHOD FOR THE STUDY OF HEAT TRANSFER IN LONG, THIN DOMAINS , 1985 .

[292]  Edwin N. Nilson.  The Minimum-Weight Straight Fin of Triangular Profile Radiating to Space , 1960 .

[293]  Michael A. Gaynes,et al.  Design and optimization of pin fin heat sinks for low velocity applications , 1996, Twelfth Annual IEEE Semiconductor Thermal Measurement and Management Symposium. Proceedings.

[294]  J. R. Mondt,et al.  Performance of Perforated Heat Exchanger Surfaces , 1974 .

[295]  P. Razelos,et al.  Minimum mass convective fins with variable heat transfer coefficients , 1983 .

[296]  H. C. Ünal,et al.  The effect of the boundary condition at a fin tip on the performance of the fin with and without internal heat generation , 1988 .

[297]  J. Zemel,et al.  Liquid transport in micron and submicron channels , 1990 .

[298]  J. Welling,et al.  Free Convection Heat Transfer Coefficients From Rectangular Vertical Fins , 1965 .

[299]  Yogendra Joshi,et al.  Characterizing the thermal performance of a flow through electronics module (SEM-E format) using a porous media model , 1998, Fourteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.98CH36195).

[300]  H. McManus,et al.  Natural Convection Heat Transfer From Horizontal Rectangular Fin Arrays , 1967 .

[301]  C. Madhusudana.  Thermal contact conductance and rectification at low joint pressures , 1993 .

[302]  A. Shouman.  An exact general solution for the temperature distribution and the composite radiation convection heat exchange along a constant cross-sectional area fin. , 1968 .

[303]  J. Ernest Wilkins,et al.  Optimum Shapes for Fins Rejecting Heat by Convection and Radiation , 1974 .

[304]  T. Na,et al.  Transient response of fins by coordinate perturbation expansion , 1980 .

[305]  Richard James Duffin,et al.  Optimum shape of a cooling fin on a convex cylinder , 1967 .

[306]  J. R. Culham,et al.  Thermal modeling of isothermal cuboids and rectangular heat sinks cooled by natural convection , 1994 .

[307]  M. Iqbal,et al.  Temperature distribution and effectiveness of a two-dimensional radiating and convecting circular fin , 1970 .

[308]  Antonio Campo.  Variational techniques applied to radiative-convective fins with steady and unsteady conditions , 1976 .

[309]  L. Pearl.  Factors Involved in the Design and Manufacture of Bonded Heat Sinks , 1984 .

[310]  H. You.  Experimental determination of heat transfer coefficient between a microstructure and fluid , 1989 .

[311]  Computational model for optimizing longitudinal fin heat transfer in laminar internal flows , 1990 .

[312]  R. Karvinen.  Natural and forced convection heat transfer from a plate fin , 1981 .

[313]  Frederick A. Costello,et al.  Stochastic Optimization of Convective-Fin Design , 1973 .

[314]  H. H. Keller,et al.  Radiation Heat Transfer for Annular Fins of Trapezoidal Profile , 1970 .

[315]  Y. Kwon,et al.  FLOW AND THERMAL FIELD WITH RELEVANCE TO HEAT TRANSFER ENHANCEMENT OF INTERRUPTED-PLATE HEAT EXCHANGERS , 1992 .

[316]  A. Donaldson,et al.  Unsteady-state temperature distribution in a convecting fin of constant area , 1972 .

[317]  B. T. F. Chung,et al.  Optimum Design of Longitudinal Rectangular Fins and Cylindrical Spines with Variable Heat Transfer Coefficient , 1993 .

[318]  Russell Messier,et al.  Emerging Technology of Diamond Thin Films , 1989 .

[319]  E. Sparrow,et al.  Orientation effects on natural convection/radiation heat transfer from pin-fin arrays , 1986 .

[320]  S. Sasaki,et al.  Optimal structure for microgrooved cooling fin for high-power LSI devices , 1986 .

[321]  C. Schenone,et al.  Forced heat convection heat transfer from shrouded staggered fin arrays , 1990 .

[322]  Leroy S. Fletcher,et al.  Thermal enhancement techniques for SEM guide ribs and card rails , 1992 .

[323]  W. G. Smith,et al.  THE DEVELOPMENT OF ADVANCED COOLING METHODS FOR HIGH-POWER ELECTRONICS , 1990 .

[324]  N. Goldberg,et al.  Narrow Channel Forced Air Heat Sink , 1984 .

[325]  J.C.Y. Koh,et al.  Heat transfer of microstructure for integrated circuits , 1986 .

[326]  Chen-Ya Liu,et al.  On optimum rectangular cooling fins , 1961 .

[327]  Haim H. Bau,et al.  Uniform Channel Micro Heat Exchangers , 1997 .

[328]  Steady-state and transient performance of a shrouded longitudinal fin array , 1993 .

[329]  J. W. Stachiewicz.  Effect of Variation of Local Film Coefficients on Fin Performance , 1969 .

[330]  S. Venkateshan,et al.  Experimental study of free convection and radiation in horizontal fin arrays , 1996 .

[331]  K. A. Gardner.  Erratum: “Efficiency of Extended Surface” (Journal of Heat Transfer, 1945, 67, pp. 621–631) , 1976 .

[332]  James N. Walpole,et al.  Microchannel heat sinks for two-dimensional high-power-density diode laser arrays , 1989 .

[333]  A. Reisman,et al.  Thermal analysis of a multi-chip package design , 1989 .

[334]  Anthony M. Jacobi,et al.  Flow and heat transfer in microchannels using a microcontinuum approach , 1989 .

[335]  D. Ingham,et al.  The One-Dimensional Analysis of Oscillatory Heat Transfer in a Fin Assembly , 1992 .

[336]  K. C. Avis,et al.  An analysis technique for a small pulsed source connected to a large sink with application to gallium arsenide IMPATT diodes , 1988, Fourth Annual IEEE Semiconductor Thermal and Temperature Measurement Symposium.

[337]  H. Hung.  Heat Transfer of Thin Fins With Stochastic Root Temperature , 1969 .

[338]  Suhas V. Patankar,et al.  Cooling of a Vertical Shrouded Fin Array by Natural Convection: A Numerical Study , 1987 .

[339]  R. Phillips,et al.  Microchannel heat sinks , 1988 .

[340]  R. E. Hendron,et al.  Test Results of Wafer Thin Coolers at Heat Fluxes from 5 to 125 W/cm 2 , 1988 .

[341]  G. Xi,et al.  EXPERIMENTAL STUDY ON HEAT TRANSFER CHARACTERISTICS OF OFFSET FIN ARRAYS -EFFECT OF FIN THICKNESS IN THE LOW AND MIDDLE RANGES OF REYNOLDS NUMBER- , 1990 .

[342]  K. Haberger,et al.  High performance forced air cooling scheme employing microchannel heat exchangers , 1995 .

[343]  Avram Bar-Cohen,et al.  Fin Thickness for an Optimized Natural Convection Array of Rectangular Fins , 1979 .

[344]  Joseph L. Levy,et al.  Stackable wafer-thin coolers for high-power laser-diode arrays , 1990, Photonics West - Lasers and Applications in Science and Engineering.

[345]  G. Csanky.  Thermal model for double-drift IMPATT diodes on diamond heat sinks , 1989 .

[346]  J. Bonhaus,et al.  Diamond heat spreaders for high power devices with integrated temperature sensors , 1998, Fourteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.98CH36195).

[347]  Frede Blaabjerg,et al.  An advanced microprocessor based temperature controlled heatsink , 1993, Proceedings of IECON '93 - 19th Annual Conference of IEEE Industrial Electronics.

[348]  Robert J. Bailey,et al.  High-power hybrid two-dimensional surface-emitting AlGaAs diode laser arrays , 1990, Photonics West - Lasers and Applications in Science and Engineering.

[349]  Adrian Bejan,et al.  The Optimal Spacing for Cylinders in Crossflow Forced Convection , 1995 .

[350]  M. Gaynes,et al.  Evaluation of thermally conductive adhesives for bonding heat sinks to electronic packages , 1993, Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93).

[351]  Albert T. Macrander,et al.  Recent experiments with liquid gallium cooling of crystal diffraction optics (abstract)a) , 1992 .

[352]  A. Aziz.  Perturbation solution for convective fin with internal heat generation and temperature dependent thermal conductivity , 1977 .

[353]  B. Natarajan,et al.  Parametric Study of Heatspreader Thermal Performance in 48 Lead Plastic DIP's and 68 Lead Plastic Leaded Chip Carriers , 1986 .

[354]  A. A. Sfeir,et al.  The Heat Balance Integral in Steady-State Conduction , 1976 .

[355]  Extended Surface Heat Rejection Accounting for Stochastic Sink Temperatures , 1981 .

[356]  G. Guglielmini,et al.  Natural convection and radiation heat transfer from staggered vertical fins , 1987 .

[357]  Panagiotis Razelos,et al.  Errors due to the Length of Arc Idealization in Convective Extended Surfaces , 1994 .

[358]  J. Westwater,et al.  Spheres, hemispheres and DISCS as high-performance fins for boiling heat transfer , 1974 .

[359]  M. Mahalingam,et al.  Thermal limits of flip chip package-experimentally validated, CFD supported case studies , 1997 .

[360]  T. Love,et al.  A LINEARIZED ANALYSIS FOR LONGITUDINAL FINS WITH RADIATIVE AND CONVECTIVE EXCHANGE , 1978 .

[361]  A. Snider.  The optimal fin profile — a study in heuristics and rigor , 1987 .

[362]  Y. Assouad,et al.  Advanced cooling techniques comparison for airborne electronic circuits , 1997, Thirteenth Annual IEEE. Semiconductor Thermal Measurement and Management Symposium.

[363]  Suhas V. Patankar,et al.  Numerical Prediction of Flow and Heat Transfer in an Impingement Heat Sink , 1997 .

[364]  Abdul Aziz,et al.  Multidimensional Steady Conduction in Convecting, Radiating, and Convecting-Radiating Fins and Fin Assemblies , 1995 .

[365]  R. Pease,et al.  High-performance heat sinking for VLSI , 1981, IEEE Electron Device Letters.

[366]  J. R. Rujano,et al.  Transient Response of Microchannel Heat Sinks in a Silicon Wafer , 1997 .

[367]  A. Bejan,et al.  Fin Geometry for Minimum Entropy Generation in Forced Convection , 1982 .

[368]  J. Wilkins.  Minimum Mass Thin Fins with Specified Minimum Thickness , 1961 .

[369]  D. Copeland.  Manifold Microchannel Heat Sinks : Analysis and Optimization , 1995 .

[370]  Allan D. Kraus,et al.  Sixty-Five Years of Extended Surface Technology (1922–1987) , 1988 .

[371]  R. C. Chu,et al.  Cooling Technology for High Performance Computers: Design Applications , 1994 .

[372]  Richard A. Wirtz,et al.  Effect of Flow Bypass on the Performance of Longitudinal Fin Heat Sinks , 1994 .

[373]  Ephraim M Sparrow,et al.  Effects of fin base-temperature depression in a multifin array , 1975 .

[374]  N. Ashiwake,et al.  Forced Convectiv Heat Transfer from LSI Packages in an Air-Cooled Wiring Card Array , 1988 .

[375]  Issam Mudawar,et al.  High flux boiling in low flow rate, low pressure drop mini-channel and micro-channel heat sinks , 1994 .

[376]  M. G. Choi,et al.  Experimental study on the liquid cooling of a test MCM using paraffin slurry , 1998, ITherm'98. Sixth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.98CH36208).

[377]  Steven B. Sutton,et al.  Microchannel-cooled heatsinks for high-average-power laser diode arrays , 1993, Photonics West - Lasers and Applications in Science and Engineering.

[378]  Raymond J. Beach,et al.  Modular microchannel cooled heatsinks for high average power laser diode arrays , 1992 .

[379]  Ephraim M Sparrow,et al.  Temperature Depression at the Base of a Fin , 1970 .

[380]  A.L. London.  Air-coolers for high power vacuum tubes , 1954, Transactions of the IRE Professional Group on Electron Devices.

[381]  A. Aziz.  Optimum Dimensions of Extended Surfaces Operating in a Convective Environment , 1992 .

[382]  I. Dul’kin,et al.  Heat transfer during liquid boiling on fins with an insulating coating , 1971 .

[383]  M. R. Vogel.  Liquid cooling performance for a 3-D multichip module and miniature heat sink , 1995 .

[384]  William D. Goodhue,et al.  Monolithic Two-dimensional Surface-emitting Arrays Of GaAs/AlGaAs Diode Lasers , 1987, Conference Proceedings LEOS Lasers and Electro-Optics Society.

[385]  A. Aziz,et al.  Application of perturbation techniques to heat-transfer problems with variable thermal properties , 1976 .

[386]  R.C. Jaeger,et al.  Re-entrant cavity heat sinks formed by anisotropic etching and silicon direct wafer bonding , 1992, [1992 Proceedings] Eighth Annual IEEE Semiconductor Thermal Measurement and Management Symposium.

[387]  Richard A. Wirtz,et al.  CONVECTION IN ARRAYS OF ELECTRONIC PACKAGES CONTAINING LONGITUDINAL FIN HEAT SINKS , 1994 .

[388]  Vinod Kamath.  Air injection and convection cooling of multi-chip modules: a computational study , 1994, Proceedings of 1994 4th Intersociety Conference on Thermal Phenomena in Electronic Systems (I-THERM).

[389]  Avram Bar-Cohen.  Thermal Management of Air- and Liquid-Cooled Multichip Modules , 1987 .

[390]  M. Taslim,et al.  An experimental investigation of a staggered array of heatsinks in the hydrodynamic and thermal entrance regions of a duct , 1992, [1992 Proceedings] Intersociety Conference on Thermal Phenomena in Electronic Systems.

[391]  Cha'o-Kuang Chen,et al.  Transient Response of Fins by Optimal Linearization and Variational Embedding Methods , 1982 .

[392]  R. Yeh.  Optimum spines with temperature dependent thermal parameters , 1994 .

[393]  R. E. Simons,et al.  The evolution of IBM high performance cooling technology , 1995, Proceedings of 1995 IEEE/CPMT 11th Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM).

[394]  G. Xi,et al.  Mechanism of heat transfer enhancement due to self-sustained oscillation for an in-line fin array , 1994 .

[395]  Sushil H. Bhavnani,et al.  Effect of channel width on pool boiling from a microconfigured heat sink , 1994 .

[396]  J. Miles,et al.  Transient thermal contact resistance in a diode heat-sink assembly , 1991 .

[397]  H. Chu,et al.  Transient Response of Circular Pins , 1983 .

[398]  Goodarz Ahmadi,et al.  Some optimization problems related to cooling fins , 1973 .

[399]  D. Ingham,et al.  Boundary Integral Equation Analysis of Fin Assembly Heat Transfer , 1981 .

[400]  P. Ghoshdastidar,et al.  Transient heat transfer from a straight composite fin: A numerical solution by ADI , 1989 .

[401]  Measured Heat Transfer Coefficients at and Adjacent to the Tip of a Wall-Attached Cylinder in Crossflow—Application to Fins , 1981 .

[402]  M. Mark,et al.  Design and Performance of Air-Cooled Chassis for Electronic Equipment , 1956 .

[403]  M. R. Vogel.  Thermal performance of air-cooled hybrid heat sinks for a low velocity environment , 1994, Proceedings of 1994 IEEE/CHMT 10th Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM).

[404]  A. L. Peterson.  Silicones with improved thermal conductivity for thermal management in electronic packaging , 1990, 40th Conference Proceedings on Electronic Components and Technology.

[405]  B. J. Selig,et al.  The design and development of the heavy water organic cooled reactor (HWOCR) pressure tube assembly , 1967 .

[406]  J. Pembroke,et al.  Forced Convection Air Cooling of Simulated Low Profile Electronic Components: Part 1—Base Case , 1991 .

[407]  A. Aziz,et al.  Two-dimensional effects in a triangular convecting fin , 1992 .

[408]  L. Buller,et al.  Effects of radiation on enhanced electronic cooling , 1988, Fourth Annual IEEE Semiconductor Thermal and Temperature Measurement Symposium.

[409]  C. L. Chapman,et al.  Thermal performance of an elliptical pin fin heat sink , 1994, Proceedings of 1994 IEEE/CHMT 10th Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM).

[410]  A. Aziz.  Optimum design of a rectangular fin with a step change in cross-sectional area , 1994 .

[411]  P. L. Dhar,et al.  Optimum design of finned surfaces , 1976 .

[412]  D. R. Barbour,et al.  Thermal conduction module: a high-performance multilayer ceramic package , 1982 .

[413]  H. Bau,et al.  Micro Heat Exchangers Consisting of Pin Arrays , 1997 .

[414]  P. Razelos.  A note on the heat transfer in convective fins , 1979 .

[415]  J. G. Josenhans,et al.  Diamond as an insulating heat sink for a series combination of IMPATT diodes , 1968 .

[416]  Ephraim M Sparrow,et al.  Radiating, convecting and conducting fins: Numerical and linearized solutions , 1968 .

[417]  Arthur David Snider,et al.  Mathematical techniques in extended surface analysis , 1982 .

[418]  D. E. Klett,et al.  The Effect of Thermal Conductivity and Base-Temperature Depression on Fin Effectiveness , 1972 .

[419]  J. Westwater,et al.  EFFECT OF GEOMETRY AND WALL THICKNESS ON HEAT TRANSFER FROM LONGITUDINAL FINS TO BOILING LIQUIDS , 1974 .

[420]  Benjamin T.F. Chung,et al.  Minimum mass longitudinal fins with radiation interaction at the base , 1991 .

[421]  G. Ellison.  Generalized Computations of the Gray Body Shape Factor for Thermal Radiation from a Rectangular U-Channel , 1979 .

[422]  J. Cleaver,et al.  Vertical Circular Pin With Conjugated Natural Convection–Conduction Flow , 1984 .

[423]  Dan R. McCutchan,et al.  Pentium processor thermal design guidelines , 1994, Microprocess. Microsystems.

[424]  M. Kohara,et al.  High Thermal Conduction Package Technology for Flip Chip Devices , 1983 .

[425]  D. W. Van de Pol,et al.  Free Convection Nusselt Number for Vertical U-Shaped Channels , 1973 .

[426]  Edward B. Eichelberger,et al.  IBM ES/9000 model 320 air cooled computer technology , 1991, COMPCON Spring '91 Digest of Papers.

[427]  Panagiotis Razelos,et al.  Two-Dimensional Effects and Design Criteria for Convective Extended Surfaces , 1992 .

[428]  K. E. Starner,et al.  An Experimental Investigation of Free-Convection Heat Transfer From Rectangular-Fin Arrays , 1963 .

[429]  Heat Transfer Characteristics for a Plate Fin , 1986 .

[430]  Kenneth E. Goodson.  Thermal Conduction in Nonhomogeneous CVD Diamond Layers in Electronic Microstructures , 1996 .

[431]  D. Metzger,et al.  Row Resolved Heat Transfer Variations in Pin-Fin Arrays Including Effects of Non-Uniform Arrays and Flow Convergence , 1986 .

[432]  A. Muzzio,et al.  Approximate Solution for Convective Fins With Variable Thermal Conductivity , 1976 .

[433]  Yoshihiro Kondo,et al.  Algorithm for Prediction of the Thermal Resistance of Finned LSI Packages Mounted on a Circuit Board. , 1992 .

[434]  R. Nelson,et al.  Application of air cooled microchannel heat exchangers to card cage systems , 1993, [1993 Proceedings] Ninth Annual IEEE Semiconductor Thermal Measurement and Management Symposium.

[435]  M. F. Sarabia,et al.  Heat Transfer From Gray Fin-Tube Radiators , 1966 .

[436]  K. Azar,et al.  Effect of Pin Fin Density of the Thermal Performance of Unshrouded Pin Fin Heat Sinks , 1994 .

[437]  Improved formulations for the analysis of convecting and radiating finned surfaces , 1983 .

[438]  E. Sparrow,et al.  Conjugate Forced Convection-Conduction Analysis of Heat Transfer in a Plate Fin , 1982 .

[439]  Tian-Yih Wang.  Conjugate mixed convection-conduction heat transfer along a vertical cylindrical fin in non-Newtonian fluids , 1994 .

[440]  R. Yeh.  Optimization of Longitudinal Fins with Temperature-Dependent Thermal Parameters , 1994 .

[441]  W. Nakayama,et al.  Manifold microchannel heat sinks: isothermal analysis , 1996 .

[442]  H. Ünal.  Temperature distributions in fins with uniform and non-uniform heat generation and non-uniform heat transfer coefficient , 1987 .

[443]  Kirk D. Hagen.  Perturbation analysis of tapered fins with nonlinear thermal properties , 1988 .

[444]  N. V. Suryanarayana.  Transient Response of Straight Fins , 1975 .

[445]  J. Westwater,et al.  Use of coatings of low thermal conductivity to improve fins used in boiling liquids , 1972 .

[446]  G. B. Kromann.  Thermal modeling and experimental characterization of the C4/surface-mount-array interconnect technologies , 1994, 1994 Proceedings. 44th Electronic Components and Technology Conference.

[447]  A. Bejan,et al.  The optimal spacing of cylinders in free-stream cross-flow forced convection , 1996 .

[448]  M. A. Townsend,et al.  Optimization of Radiating Fin Arrays With Respect to Weight , 1976 .

[449]  Norman Epstein,et al.  Particulate Fouling of Heat Transfer Surfaces: Mechanisms and Models , 1988 .

[450]  R. Jaeger,et al.  Heat sink optimization with application to microchannels , 1992 .

[451]  T. Kishimoto,et al.  Cooling characteristics of diamond-shaped interrupted cooling fin for high-power LSI devices , 1987 .

[452]  T. Na,et al.  Periodic heat transfer in fins with variable thermal parameters , 1981 .

[453]  Suhas V. Patankar,et al.  Laminar Mixed Convection in a Shrouded Fin Array , 1981 .

[454]  HEAT TRANSFER ANALYSIS AND EVALUATION FOR TWO-PHASE FLOW IN POROUS-CHANNEL HEAT SINKS , 1997 .

[455]  M. H. Cobble.  Nonlinear fin heat transfer , 1964 .

[456]  T. Kuehn,et al.  Conjugate natural convection heat transfer from a horizontal cylinder with a long vertical longitudinal fin , 1983 .

[457]  V. Kadambi,et al.  An analysis of the thermal response of power chip packages , 1985, IEEE Transactions on Electron Devices.

[458]  E. M. Sparrow.  Radiating Effectiveness of Annular-Finned Space Radiators, Including Mutual Irradiation Between Radiators Elements , 1962 .

[459]  Wu Wen-Jyi,et al.  Transient response of a spiral fin with its base subjected to a sinusoidal form in temperature , 1990 .

[460]  P. Razelos.  The optimum dimensions of convective pin fins with internal heat generation , 1986 .

[461]  J. J. Barker.  The Efficiency of Composite Fins , 1958 .

[462]  Arthur David Snider,et al.  OPTIMAL FIN PROFILES - CLASSICAL AND MODERN , 1990 .

[463]  S. Rea,et al.  Thermal Radiation from Finned Heat Sinks , 1976 .

[464]  W. T. Rouleau,et al.  The Effects of Internal Heat Generation on Heat Transfer in Thin Fins , 1960 .

[465]  David P. Kennedy,et al.  Spreading Resistance in Cylindrical Semiconductor Devices , 1960 .

[466]  K. Board.  Thermal properties of annular and array geometry semiconductor devices on composite heat sinks , 1973 .

[467]  Edward K. Levy.  Optimum Plate Spacings for Laminar Natural Convection Heat Transfer From Parallel Vertical Isothermal Flat Plates , 1971 .

[468]  Peter J. Heggs,et al.  The Effects of Dimensions on the Heat Flowrate through Extended Surfaces , 1980 .

[469]  A. Mertol.  Optimization of Extruded Type External Heat Sink for Multichip Module , 1993 .

[470]  A. A. Sverdlov,et al.  Numerical analysis of temperature stabilization of buried pipelines , 1984 .

[471]  J. S. Goodling.  Microchannel heat exchangers: a review , 1993, Optics & Photonics.

[472]  Haim Kalman,et al.  Transient temperature response of different fins to step initial conditions , 1993 .

[473]  A. London,et al.  Compact heat exchangers , 1960 .

[474]  R. K. Irey,et al.  Errors in the One-Dimensional Fin Solution , 1968 .

[475]  J. Zemel,et al.  Analysis of microchannels for integrated cooling , 1992 .

[476]  J. Sunderland,et al.  Natural convection from pin fin arrays , 1990 .

[477]  W. Nakayama,et al.  Heat transfer from micro-finned and flat surfaces to flow of Fluorinert coolant; boiling heat transfer , 1998, ITherm'98. Sixth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.98CH36208).

[478]  J. G. Bartas,et al.  Radiation Fin Effectiveness , 1960 .

[479]  I. Mikk,et al.  Convective fin of minimum mass , 1980 .

[480]  A. Tolpadi,et al.  Experimental investigation of conjugate natural convection heat transfer from a horizontal isothermal cylinder with a nonisothermal longitudinal plate fin at various angles , 1985 .