论文信息 - Effect of Al-trace dimension on Joule heating and current crowding in flip-chip solder joints under accelerated electromigration

Effect of Al-trace dimension on Joule heating and current crowding in flip-chip solder joints under accelerated electromigration

Three-dimensional thermoelectrical simulation was conducted to investigate the influence of Al-trace dimension on Joule heating and current crowding in flip-chip solder joints. It is found that the dimension of the Al-trace effects significantly on the Joule heating, and thus directly determines the mean time to failure (MTTF). Simulated at a stressing current of 0.6A at 70°C, we estimate that the MTTF of the joints with Al traces in 100μm width was 6.1 times longer than that of joints with Al traces in 34μm width. Lower current crowding effect and reduced hot-spot temperature are responsible for the improved MTTF.

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