论文信息 - Segregant-induced cavitation of Sn/Cu reactive interface

Segregant-induced cavitation of Sn/Cu reactive interface

A dense population of voids was found along the interface between Cu3Sn and Cu following prolonged aging. The voids appeared only on the Cu3Sn/Cu interface that had been covered by roughly monolayer of Bi segregant. Void formation was related to vacancy condensation after the segregant took up vacancy sinks.

J. Shang | Pan Liu | Jian Ku Shang | Pan Liu

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