Dynamic scaling of the surface roughness of Cu deposited using a chemical bath

In electroless deposition, a chemical reducing agent is used to deposit a metal film from a solution of its ions. Electroless Cu films deposited with HCHO as the reducing agent exhibit anomalous scaling, with the rootmean-square interface width w varying as t β loc at short length scales. Changing the HCHO concentration changes the growth rate, but not the scaling exponents other than β l o c . The nonchanging exponents were measured as H=0.74′0.03 and β=0.28′0.03, where H is the Hurst exponent, and w varies as t β + β loc at long length scales. Our results reveal similarities with the dynamic scaling of conventional electrodeposited films.