Novel pre-treatment process for liberation of metals from waste printed circuit boards using organic solution

A method for collecting metal from the wasted printed circuit board using the organic solution is provided to raise the recovery rate of metal by pretreating the wasted printed circuit board using the organic solvent. The cut wasted printed circuit board is put into in the organic solvent. The organic solvent is the N, N-Dimethylformamide, the methyl ethyl ketone, Tetrahydrofuran, Stripoxy or their mixture. The metal and plastic are selected by mixing the wasted printed circuit board. The separated metal and plastic are separated from the organic solution by using sieve. The separated metal and plastic mixture are washed and dried.