论文信息 - Elimination of Twin Boundaries when Growing 3C-SiC Heteroepitaxial by Vapour-Liquid-Solid Mechanism on Patterned 4H-SiC Substrate

Elimination of Twin Boundaries when Growing 3C-SiC Heteroepitaxial by Vapour-Liquid-Solid Mechanism on Patterned 4H-SiC Substrate

In this work we report on the study of twin boundary (TB) evolution during heteroepitaxial growth of 3C-SiC on patterned 4H-SiC(0001) substrate by vapour-liquid-solid (VLS) mechanism. Ge50Si50 melt was used at a temperature of 1450°C. 3C-SiC deposit was obtained on top and outside the mesas. Some lateral enlargement of these mesas was observed but it was systematically homoepitaxial. Elimination of TBs inside the 3C-SiC deposit on top of the mesas was observed for specific mesa shape and/or orientation of the sidewalls. Though three–fold or six-fold symmetry mesas are recommended for TB elimination, originally circular mesas lead also to the same result due to initial faceting toward hexagonal shape.

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