论文信息 - Nanomechanical test structure for optimal alignment in stencil-based lithography

Nanomechanical test structure for optimal alignment in stencil-based lithography

A nanoelectromechanical mass sensor based on a submicron size resonating metallic beam is used to characterize material deposition rates in stencil lithography. The material flux through micron size apertures is mapped with high spatial (below 1 ¿m) and deposition rate (below 10 pm/s) resolutions by displacing stencil apertures above the sensor. It is discussed how the sensor can be used as a test alignment for multi-level nanostencil lithography.

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