EPOXY THERMOSETS AND THEIR APPLICATIONS. II. THERMAL ANALYSIS

Since the curing process of an epoxy thermoset is thermally-activated and temperature dependent, thermal analysis is the most common method to monitor the process. In addition, many common temperature-dependent properties like heat capacity and modulus change with the degree of cure or extent of cross-linking. Common thermal analysis techniques which are applicable to the study of thermoset cure are reviewed, specifically differential scanning calorimetry (DSC and TMDSC), thermomechanical and dynamic mechanical analysis (TMA and DMA), thermally stimulated depolarization (TSD), and thermogravimetric analysis (TGA).

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