论文信息 - Study on simulation-based optimization for flip chip package parameters by using RSM analysis and Ant algorithm

Study on simulation-based optimization for flip chip package parameters by using RSM analysis and Ant algorithm

In this paper, a simulation-based optimization methodology combining the Response Surface Method (RSM) and a newly developed Ant Algorithm is introduced. An approximate function between the chief packaging parameters and the maximum value of the equivalent stress in the solder joints has been built. Finally, the better solution of the chief packaging parameters is obtained from Ant Algorithm.

Junsheng Liang | Daoguo Yang | Yubing Gong | Quanyong Li

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