Reliability evaluation structures for stacked thin dice packaging

This paper introduces a test chip which is going to be used in experimental study in reliability tests for flip chip joints on a planar PCB and in a 3-D stacked thin dice package. The test chip is 11.1x12.0mm2 in size and it contains various electrical and thermal test structures. The chip consists of four independent test dice. These can he measured all together as a larger test chip or each die can be cut and measured separately. This paper provides an overview of the test chip and introduces the function of the test structures.

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