Challenges and progress in x-ray lithography

X-ray lithography (XRL) is a very promising technique with the potential to be available for integrated circuit manufacturing as early as the 130 nm generation. As a result of many years of development, the technology is relatively mature. Synchrotron sources have demonstrated performance and reliability; preproduction aligners are available from multiple vendors; significant improvements are being made in mask fabrication; and high resolution imaging has been demonstrated at 100 nm and below. Established vendors already have experience with almost all of the tools that are needed, although improved performance is required for most in order to satisfy the error budgets at 130 nm and below. Significant development activities are continuing in both the United States and Japan, and numerous complex integrated circuits have been fabricated using XRL for one or more critical levels. Nonetheless, there are challenges still to be met. Among the most important are the development and commercial availability of an...