Imaging Integrated Circuits with X-ray Microscopy

We introduce x-ray microscopy as a method for imaging integrated circuits. Compared to physical de- layering combined with scanning electron microscopy, this method is non-destructive, requiring only sample thinning to approximately 100 um but otherwise leaving the sample intact. Using multiple views and 3D tomography, individual integrated circuit layers can be imaged. Current imaging resolution is approximately 30 nm, and is constantly improving with advances in nano-fabrication for hard x-ray optics.