SU-8-Based Structural Material for Microelectronic Processing Applications

This article presents research on the applications of SU-8-based structural material for three different types of semiconductor processing. The processing method using SU-8 as a cost-effective final protection layer replaces the traditional SiNx or SiO2 thin films in integrated passive devices (IPDs). To evaluate the moisture resistance of the SU-8 films, SU-8 and SiNx are subjected to 1,000 h, 85°C, 85% relative humidity (RH) reverse bias tests and the results are compared. SU-8 is also applied as an isolation layer in light-emitting diode (LED) module fabrication processing, which provides electrical isolation and protection for the ground Cu/Ni/Au-plated metal interconnection. Finally, SU-8 is used in high electron mobility transistor (HEMT) input/output matching circuit as a dielectric layer for the realization of DC block capacitor.

[1]  Shuichi Shoji,et al.  An all SU-8 microfluidic chip with built-in 3D fine microstructures , 2006 .

[2]  Fang Zhang,et al.  A novel method for the fabrication of integrated passive devices on SI-GaAs substrate , 2011 .

[3]  M. Laudon,et al.  Mechanical characterization of a new high-aspect-ratio near UV-photoresist , 1998 .

[4]  M. Parameswaran,et al.  A planar self-sacrificial multilayer SU-8-based MEMS process utilizing a UV-blocking layer for the creation of freely moving parts , 2006 .

[5]  Yuan Lu,et al.  Synthesis of Porous Silicon Nitride Ceramics from Diatomite , 2010 .

[6]  Chen Chen,et al.  AlGaN/GaN HEMT with over 110 W Output Power for X-Band , 2008, 2008 European Microwave Integrated Circuit Conference.

[7]  Hyman Joseph Levinstein,et al.  Reactive Plasma Deposited Si‐N Films for MOS‐LSI Passivation , 1978 .

[8]  A. M. Jorgensen,et al.  The effect of soft bake temperature on the polymerization of SU-8 photoresist , 2006 .

[9]  Nam-Young Kim,et al.  Analytical optimization of high-performance and high-yield spiral inductor in integrated passive device technology , 2012, Microelectron. J..

[10]  Jane M. Shaw,et al.  Micromachining applications of a high resolution ultrathick photoresist , 1995 .

[11]  Nam-Young Kim,et al.  High‐performance integrated passive technology by advanced SI‐GaAs‐based fabrication for RF and microwave applications , 2010 .

[12]  K. Mogensen,et al.  Integration of polymer waveguides for optical detection in microfabricated chemical analysis systems. , 2003, Applied optics.

[13]  Stress measurement as a new technique for determining glass transition temperatures and other thermomechanical properties of polymers , 1994 .

[14]  Gwo-Bin Lee,et al.  A new fabrication process for ultra-thick microfluidic microstructures utilizing SU-8 photoresist , 2002 .

[15]  N. Chronis,et al.  Electrothermally activated SU-8 microgripper for single cell manipulation in solution , 2005, Journal of Microelectromechanical Systems.

[16]  Y. Wang,et al.  High power X-band internally-matched AlGaN/GaN HEMT , 2008, 2008 Asia-Pacific Microwave Conference.

[17]  Nam-Young Kim,et al.  Si-based packaging platform for LED module using electroplating method , 2010 .

[18]  M. Parameswaran,et al.  Polymer MEMS processing for multi-user applications , 2007 .

[19]  Enboa Wu,et al.  Modeling white light-emitting diodes with phosphor layers , 2006 .

[20]  A. M. Jorgensen,et al.  Lab-on-a-chip with integrated optical transducers. , 2006, Lab on a chip.

[21]  Shang-Lin Wu,et al.  High density and through wafer copper interconnections and solder bumps for MEMS wafer-level packaging , 2004 .

[22]  Stéphane Colin,et al.  A novel fabrication method of flexible and monolithic 3D microfluidic structures using lamination of SU-8 films , 2005 .

[23]  C. Tsou,et al.  Silicon-based packaging platform for light-emitting diode , 2005, IEEE Transactions on Advanced Packaging.

[24]  M. Despont,et al.  SU-8: a low-cost negative resist for MEMS , 1997 .

[26]  P. Bidaud,et al.  Fabrication and characterization of an SU-8 gripper actuated by a shape memory alloy thin film , 2003 .