Suppressing-accelerating effect of Nitrotetrazolium Blue chloride in boosting superconformal cobalt filling

[1]  Anmin Liu,et al.  Construction of Self-Supporting NiCoFe Nanotube Arrays Enabling High-Efficiency Alkaline Oxygen Evolution. , 2022, ACS applied materials & interfaces.

[2]  Anmin Liu,et al.  Investigation of novel leveler Rhodamine B on copper superconformal electrodeposition of microvias by theoretical and experimental studies , 2022, Applied Surface Science.

[3]  Jin-qiu Zhang,et al.  A novel bright additive for copper electroplating: electrochemical and theoretical study , 2022, Ionics.

[4]  Anmin Liu,et al.  The Influence of Leveler Brilliant Green on Copper Superconformal Electroplating Based on Electrochemical and Theoretical study , 2022, Journal of Industrial and Engineering Chemistry.

[5]  Jin-qiu Zhang,et al.  Influence of Suppressing Additive Malachite Green on Superconformal Cobalt electrodeposition , 2022, Journal of Electroanalytical Chemistry.

[6]  Peixia Yang,et al.  Zinc-assisted MgO Template Synthesis of Porous Carbon-Supported Fe-Nx Sites for Efficient Oxygen Reduction Reaction Catalysis in Zn-air Batteries , 2022, Applied Catalysis B: Environmental.

[7]  A. Miakonkikh,et al.  Cobalt subtractive etch for advanced interconnects , 2022, International Conference on Micro- and Nano-Electronics.

[8]  T. Moffat,et al.  Simulating the Influence of Supporting Electrolyte Concentration on Copper Electrodeposition in Microvias , 2022, Journal of The Electrochemical Society.

[9]  Chuanjing Xu,et al.  Optimization of electrodeposition nanocrytalline Ni-Fe alloy coatings for the replacement of Ni coatings , 2022, Journal of Alloys and Compounds.

[10]  T. Moffat,et al.  Simulating Cu electrodeposition in high aspect ratio features: Effect of control mode and uncompensated resistance in S-NDR systems , 2021 .

[11]  V. R. Soma,et al.  Ultrafast Coherent Anti-Stokes Raman spectroscopic studies of nitro/nitrogen rich aryl-tetrazole derivatives , 2020 .

[12]  Tighe A. Spurlin,et al.  The Multi-Functional Role of Boric Acid in Cobalt Electrodeposition and Superfill , 2020 .

[13]  Qingguo Chen,et al.  Investigation of polyvinylpyrrolidone as an inhibitor for trench super-filling of cobalt electrodeposition , 2020 .

[14]  K. Croes,et al.  Electromigration Activation Energies in Alternative Metal Interconnects , 2019, IEEE Transactions on Electron Devices.

[15]  C. Lavoie,et al.  Spin-dependent electron scattering in cobalt interconnects , 2019, Journal of Physics D: Applied Physics.

[16]  Natalia V. Doubina,et al.  The Critical Role of pH Gradient Formation in Driving Superconformal Cobalt Deposition , 2018, Journal of The Electrochemical Society.

[17]  S. Branagan,et al.  Mechanism of Cobalt Bottom-Up Filling for Advanced Node Interconnect Metallization , 2018, Journal of The Electrochemical Society.

[18]  Chen Guoming,et al.  Simulation and assessment of underwater gas release and dispersion from subsea gas pipelines leak , 2018, Process Safety and Environmental Protection.

[19]  Dooho Choi.  Potential of Ruthenium and Cobalt as Next-generation Semiconductor Interconnects , 2018, Korean Journal of Metals and Materials.

[20]  Christopher J. Wilson,et al.  Sub-100 nm2 Cobalt Interconnects , 2018, IEEE Electron Device Letters.

[21]  R. Torresi,et al.  Influence of glycine on Co electrodeposition: IR spectroscopy and near-surface pH investigations , 2018 .

[22]  Qiang Huang,et al.  Effects of Cyclohexane- Monoxime and Dioxime on the Electrodeposition of Cobalt , 2017 .

[23]  Qiang Huang,et al.  Electrodeposition of Cobalt for Interconnect Application: Effect of Dimethylglyoxime , 2016 .

[24]  T. Moffat,et al.  Superconformal Bottom-Up Cobalt Deposition in High Aspect Ratio Through Silicon Vias. , 2016, ECS transactions.

[25]  Shaona Chen,et al.  A Ag-molecularly imprinted polymer composite for efficient surface-enhanced Raman scattering activities under a low-energy laser. , 2015, The Analyst.

[26]  Azad Naeemi,et al.  A Proposal for a Novel Hybrid Interconnect Technology for the End of Roadmap , 2014, IEEE Electron Device Letters.

[27]  U. Geiger,et al.  The Raman spectrum of dimethylaminophenyl pentazole (DMAPP) , 2013 .

[28]  J. A. Paixão,et al.  Structural investigation of nitrogen-linked saccharinate–tetrazole , 2011 .

[29]  Wei-Ping Dow,et al.  Copper Fill of Microvia Using a Thiol-Modified Cu Seed Layer and Various Levelers , 2009 .

[30]  T. Moffat,et al.  Electrodeposition of Copper in the SPS-PEG-Cl Additive System I. Kinetic Measurements: Influence of SPS , 2004 .

[31]  J. Rubim,et al.  Effect of sodium dodecylsulfate on copper corrosion in sulfuric acid media in the absence and presence of benzotriazole , 1999 .

[32]  P. Broekmann,et al.  In-situ STM investigation of specific anion adsorption on Cu(111)☆ , 1999 .

[33]  P. Broekmann,et al.  In-situ STM investigation of adsorbate structures on Cu(111) in sulfuric acid electrolyte , 1998 .

[34]  2021 China Semiconductor Technology International Conference (CSTIC) , 2021 .

[35]  Hong Zhu,et al.  Microvia Filling by Copper Electroplating Using a Modified Safranine T as a Leveler , 2017 .

[36]  Ieee Staff.  2014 International Reliability Physics Symposium (IRPS) , 2014 .

[37]  D. Edelstein,et al.  Mechanism of Co Liner as Enhancement Layer for Cu Interconnect Gap-Fill , 2013 .

[38]  Fang Yan.  Effects of the Halide Ion Adsorption Competition on the Near-Infrared-Surface-Enhanced Raman Spectroscopy of Rhodamine B-Au Colloid Systems , 2003 .

[39]  M. L. Cristiano,et al.  Low temperature matrix-isolation and solid state vibrational spectra of tetrazole , 2001 .