Polymer molded lenses for optoelectronics

Further enhancements to a novel optical packaging technology for datalinks are reported. Evolutionary improvements in the design, processes, and implementations of integrated lens/receptacle have been made. A new mechanical package for FDDI using the lens/receptacle has been designed in addition to the original SC-duplex and SC/ST-simplex styles. Details of the mechanical and optical design, production issues, and performance statistics are reported. The basis for this low cost packaging approach is independent integration of the optical connector and electronic functions. Precision polymer molding technology has been used to design a multifunction element providing connector ferrule seating, optoelectronic device and fiber plane placement, connector feature integration, case and process sealing, and efficient optical coupling at right angles to the fiber axis. The last feature allows for assembly of the optoelectronic devices on the same board with the circuit components. Besides ease of testing and cost reduction, eliminating the TO header in this way improves electrical and thermal performance.