论文信息 - Chip-Package interaction stress analysis and optimization for a 14nm extreme low-k chip of FCCSP package - 字舞流文

Chip-Package interaction stress analysis and optimization for a 14nm extreme low-k chip of FCCSP package

Fengman Liu | Dejian Li | Shunfeng Han | Xi Feng | Yu Guan | Bofu Li | Dameng Li | Y. Liu