论文信息 - Finite-element analysis of silicon condenser microphones with corrugated diaphragms

Finite-element analysis of silicon condenser microphones with corrugated diaphragms

In this present study, the numerical simulation of a silicon condenser microphone is conducted in order to optimize its overall performance. The geometrically nonlinear finite-element method has been adopted to analyze the mechanical sensitivity of silicon condenser microphones. Since the out-of-plane stiffness of a diaphragm can be significantly affected by the state of in-plane residual stresses, the stress stiffening is considered in this analysis. The numerical results show that the structural stiffness and the mechanical sensitivity of the diaphragm are remarkably influenced by the design parameters of microphones and its initial stresses. The optimum values of design parameters for the corrugated diaphragm are determined.

[1] J. Bergqvist,et al. A silicon condenser microphone using bond and etch-back technology , 1994 .

[2] J. Z. Zhu,et al. The finite element method , 1977 .

[3] T. Bourouina,et al. A new condenser microphone with a p+ silicon membrane , 1992 .

[4] Kurt E. Petersen,et al. Modeling of thermal and mechanical stresses in silicon microstructures , 1990 .

[5] Michael Curt Elwenspoek,et al. Membranes fabricated with a deep single corrugation for package stress reduction and residual stress relief , 1993 .

[6] Wouter Olthuis,et al. The design, fabrication, and testing of corrugated silicon nitride diaphragms , 1994 .

[7] J. Bergqvist. Finite-element modelling and characterization of a silicon condenser microphone with a highly perforated backplate , 1993 .

[8] Zhijian Li,et al. Design and fabrication of silicon condenser microphone using corrugated diaphragm technique , 1996 .

[9] Miko Elwenspoek,et al. On-chip decoupling zone for package-stress reduction , 1991 .