Innovative Theory of Low-Pass NGD via-Hole-Ground Circuit

The via ground (GND) structure constitutes one of the most useful elements for designing high performance printed circuit boards (PCBs). The electrical interconnections with vias become key regular solutions for the implementation of various electronic functions. However, so far, the vias are never being used for designing negative group delay (NGD) circuit. To answer this curious question, an original study on the design feasibility of low-pass NGD function with via ground is introduced in the present paper. After the topological description, the NGD analysis in function of the via parameters is established. The design equations allowing to synthesize the via in function of NGD function specifications are formulated. The developed NGD theory is verified with comparisons between calculations and simulations with a commercial tool. As expected, NGD value in order of hundred-picoseconds over hundred-megahertz cut-off frequencies is obtained with good agreement between the theoretical model and simulation. Furthermore, time domain analyses confirm that the via NGD structure enables to generate output signals in time-advance of arbitrary waveform input signals presenting limited bandwidth.

[1]  K. Singh,et al.  Simple Modelling Approach for Via-Hole Characterization on Silicon Substrate at Ka-Band , 2011 .

[2]  Xia Lei,et al.  Effect of Group Delay on Channel Estimation Performance in OFDM System , 2012 .

[3]  H. Liu,et al.  A Compact Dual-Band Negative Group Delay Microwave Circuit , 2018, Radioengineering.

[4]  Heinz-Dietrich Bruns,et al.  Using Via Stubs in Periodic Structures for Microwave Filter Design , 2014, IEEE Transactions on Components, Packaging and Manufacturing Technology.

[5]  Jae-Won Kim,et al.  Characterization and modeling of a new via structure in multilayered printed circuit boards , 2003 .

[6]  Morgan W. Mitchell,et al.  Causality and negative group delays in a simple bandpass amplifier , 1998 .

[7]  Wenceslas Rahajandraibe,et al.  NGD Analysis of Turtle-Shape Microstrip Circuit , 2020, IEEE Transactions on Circuits and Systems II: Express Briefs.

[8]  F. Alessandri,et al.  Full-wave modeling of via hole grounds in microstrip by three-dimensional mode matching technique , 1992 .

[9]  Blaise Ravelo,et al.  Similitude between the NGD function and filter gain behaviours , 2014, Int. J. Circuit Theory Appl..

[10]  Steven Chu,et al.  Linear Pulse Propagation in an Absorbing Medium , 1982 .

[11]  L. Leung,et al.  Microwave characterization and modeling of high aspect ratio through-wafer interconnect vias in silicon substrates , 2005, IEEE Transactions on Microwave Theory and Techniques.

[12]  Thierry Le Gouguec,et al.  Modelling up to 45 GHz of coupling between microvias and PCB cavities considering several boundary conditions , 2016 .

[13]  F. Alessandri,et al.  Full-wave modeling of via hole grounds in microstrip by three-dimensional mode matching technique , 1992, 1992 IEEE Microwave Symposium Digest MTT-S.

[14]  M. Kitano,et al.  Demonstration of negative group delays in a simple electronic circuit , 2002 .

[15]  Jun Fan,et al.  Estimating the via-plane capacitance for differential vias with shared-antipad based on analytical equations , 2017, 2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI).

[16]  Jun Fan,et al.  A survey on modeling strategies for high-speed differential Via between two parallel plates , 2017, 2017 IEEE International Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMCSI).

[17]  Jiao Feng,et al.  Design, Modeling and Synthesis of Negative Group Delay IL-Shape Topology , 2019, IEEE Access.

[18]  Cheng-Kok Koh,et al.  Synthesis of clock and power/ground networks , 2009 .

[19]  Di Jiang,et al.  Vertically Stacked Carbon Nanotube-Based Interconnects for Through Silicon Via Application , 2015, IEEE Electron Device Letters.

[20]  R. Ishikawa,et al.  Group Delay Equalized UWB InGaP/GaAs HBT MMIC Amplifier Using Negative Group Delay Circuits , 2009, IEEE Transactions on Microwave Theory and Techniques.

[21]  Zhongbao Wang,et al.  A Negative Group Delay Microwave Circuit Based on Signal Interference Techniques , 2018, IEEE Microwave and Wireless Components Letters.

[22]  Blaise Ravelo,et al.  S-Parameter Model of IB-Shape Interconnect Lines Including Crosstalk Perturbation , 2020, IEEE Transactions on Electromagnetic Compatibility.

[23]  M. Kitano,et al.  Negative group delay and superluminal propagation: an electronic circuit approach , 2003, quant-ph/0302166.

[24]  Jun-Fa Mao,et al.  Absorptive Bandstop Filter With Prescribed Negative Group Delay and Bandwidth , 2017, IEEE Microwave and Wireless Components Letters.

[25]  Blaise Ravelo,et al.  Theory and circuit modeling of baseband and modulated signal delay compensations with low- and band-pass NGD effects , 2016 .

[26]  R. Pucel,et al.  Modeling via hole grounds in microstrip , 1991, IEEE Microwave and Guided Wave Letters.

[27]  Morgan W. Mitchell,et al.  NEGATIVE GROUP DELAY AND FRONTS IN A CAUSAL SYSTEM : AN EXPERIMENT WITH VERY LOW FREQUENCY BANDPASS AMPLIFIERS , 1997 .

[28]  Jinping Xu,et al.  Compact transmission-type negative group delay circuit with low attenuation , 2017 .

[29]  Hongmei Liu,et al.  A Compact Transmission-Line Self-Matched Negative Group Delay Microwave Circuit , 2017, IEEE Access.

[30]  F. Alessandri,et al.  Full wave modeling of microstrip via holes , 1992 .

[31]  Brock J. LaMeres,et al.  CHARACTERIZATION OF A PRINTED CIRCUIT BOARD VIA , 2000 .

[32]  Shiro Dosho,et al.  Isolation Techniques Against Substrate Noise Coupling Utilizing Through Silicon Via (TSV) Process for RF/Mixed-Signal SoCs , 2012, IEEE Journal of Solid-State Circuits.

[33]  M. Karlsson.  Probability density functions of the differential group delay in optical fiber communication systems , 2001 .

[34]  Axel Jantsch,et al.  Interconnect-Centric Design for Advanced SOC and NOC , 2010 .

[35]  Hannu Tenhunen,et al.  Wires as interconnects , 2005 .

[36]  B. Segard,et al.  Observation of negative velocity pulse propagation , 1985 .

[37]  Leung Tsang,et al.  Fast Broadband Modeling of Traces Connecting Vias in Printed Circuit Boards Using Broadband Green’s Function Method , 2017, IEEE Transactions on Components, Packaging and Manufacturing Technology.

[38]  Symon K. Podilchak,et al.  High speed metamaterial-inspired negative group delay circuits in CMOS for delay equalization , 2009 .