Fins, fans, and form: volumetric limits to air-side heatsink performance

In design of high performance heatsinks, it is vital to understand how the primary constraints of volumetric footprint and hydraulic operating point limit maximum thermal performance. This paper provides a framework to establish a priori maximum attainable levels of air-side cooling performance for a given class of fin geometry over a basis of continuously varied footprint and hydraulic constraints. A model of packaging volume required for air moving devices to deliver flow and pressure is developed. It is shown how single fin thermal model results may be extrapolated to multiple fan-heatsink combinations within an open design space. A method to identify fin-fan combinations to achieve maximum system volumetric conductance levels is presented. The methodology is extendable to other volumetrically constrained heat exchanger problems.

[1]  Ioan Sauciuc,et al.  Spreading in the heat sink base: phase change systems or solid metals?? , 2002 .

[2]  M. Yovanovich,et al.  Analytical forced convection modeling of plate fin heat sinks , 1999, Fifteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.99CH36306).

[3]  Robert J. Krane Research Needs in Thermal Management of Electronic Systems , 1994 .

[4]  Adrian Bejan,et al.  Optimal Internal Structure of Volumes Cooled by Single-Phase Forced and Natural Convection , 2003 .

[5]  Adrian Bejan,et al.  Optimal Arrays of Pin Fins and Plate Fins in Laminar Forced Convection , 1993 .

[6]  David Copeland,et al.  Fundamental performance limits of heatsinks , 2003 .

[7]  A. Bejan,et al.  Entropy Generation Through Heat and Fluid Flow , 1983 .

[8]  A. London,et al.  Compact heat exchangers , 1960 .

[9]  Seri Lee Optimum design and selection of heat sinks , 1995 .

[10]  A. Bejan,et al.  The optimal spacing of parallel plates cooled by forced convection , 1992 .

[11]  S. Song,et al.  Thermal and electrical resistances of bolted joints between plates of unequal thickness , 1993, [1993 Proceedings] Ninth Annual IEEE Semiconductor Thermal Measurement and Management Symposium.

[12]  M. Yovanovich,et al.  Optimization of pin-fin heat sinks using entropy generation minimization , 2001, IEEE Transactions on Components and Packaging Technologies.

[13]  Wataru Nakayama,et al.  Information Processing and Heat Transfer Engineering , 1994 .