Thermal and Tensile Properties of Bi-Ag Alloys

This study investigated the microstructure and properties of Bi-Ag alloys, a novel Pb-free solder for high-temperature applications. The results show that Bi-Ag alloys exhibited a nonequilibrium solidification feature and a considerably large undercooling. An increase in the Ag content effectively raised the tensile strength. However, the elongation in a decreasing order was hypereutectic Bi-11Ag, pure Bi, and then eutectic Bi-2.5Ag. The fracture mode was significantly affected by microstructural characteristics and the strain rate.

[1]  W. Johnson,et al.  Mechanical properties of Zr56.2Ti13.8Nb5.0Cu6.9Ni5.6Be12.5 ductile phase reinforced bulk metallic glass composite , 2001 .

[2]  H. Sōda,et al.  Microstructure and properties of a bismuth-indium-tin eutectic alloy , 2002 .

[3]  H. Hasegawa,et al.  Influence of alloy composition on fillet-lifting phenomenon in tin binary alloys , 2001 .

[4]  O. M. Ostrikov Effect of carbon ion bombardment and surface oxidation on the twinning rate of single-crystal bismuth , 1999 .

[5]  H. Sōda,et al.  The characteristics of single crystal bismuth wires produced by the Ohno continuous casting process , 1999 .

[6]  Sungho Jin,et al.  Significantly Improved Mechanical Properties of Bi- Sn Solder Alloys by Ag- Doping , 1997 .

[7]  Nancy F. Dean,et al.  Experimental investigation of Ge-doped Bi-11Ag as a new Pb-free solder alloy for power die attachment , 2002 .

[8]  K. Suganuma Microstructural Features of Lift-off Phenomenon in Through-Hole Circuit Soldered by Sn-Bi Alloy , 1998 .

[9]  Paul T. Vianco,et al.  Properties of ternary Sn-Ag-Bi solder alloys: Part I—Thermal properties and microstructural analysis , 1999 .

[10]  J. Verhoeven Fundamentals of Physical Metallurgy , 1975 .

[11]  H. Kang,et al.  Microstructure selections in the undercooled hypereutectic Al–Si alloys , 2005 .

[12]  Paul T. Vianco,et al.  Properties of ternary Sn-Ag-Bi solder alloys: Part II—Wettability and mechanical properties analyses , 1999 .

[13]  Hyuck-Mo Lee,et al.  Thermodynamics-Aided Alloy Design and Evaluation of Pb-free Solders for High-Temperature Applications , 2002 .

[14]  Jenn-Ming Song,et al.  Microstructural characteristics and vibration fracture properties of Sn-Ag-Cu-TM (TM=Co, Ni, and Zn) alloys , 2006 .

[15]  Jenn-Ming Song,et al.  Interfacial reactions between Bi-Ag high-temperature solders and metallic substrates , 2006 .

[16]  M. Rettenmayr,et al.  High Melting Pb‐Free Solder Alloys for Die‐Attach Applications , 2005 .