In-situ sensors for product reliability monitoring

Some advantages of predicting reliability include providing advance warning signs of failure, and the reduction of life cycle costs by reducing inspection and unscheduled maintenance. However, predictions can be inaccurate if they do not account for the actual environments that the product is subjected to in its li8fe cycle. This paper describes an in-situ sensor (prognostic monitor) approach, which can be used to estimate the accumulated damage and the remaining life of semiconductor devices.

[1]  Chenming Hu,et al.  Hot-electron-induced MOSFET degradation—Model, monitor, and improvement , 1985, IEEE Transactions on Electron Devices.

[2]  Michael Pecht,et al.  Evaluation of built-in test , 2001 .

[3]  Chenming Hu,et al.  Hot-Electron-Induced MOSFET Degradation - Model, Monitor, and Improvement , 1985, IEEE Journal of Solid-State Circuits.

[4]  A. Davies,et al.  Handbook of Condition Monitoring , 1998 .

[5]  Michael Pecht,et al.  ‘SMART’ ELECTRONIC SYSTEMS FOR CONDITION‐BASED HEALTH MANAGEMENT , 1997 .

[6]  Michael Pecht,et al.  Product Reliability, Maintainability, and Supportability Handbook , 1995 .

[7]  Yibin Zhang,et al.  TRENDS IN COMPONENT RELIABILITY AND TESTING , 1999 .

[8]  Aristos Christou,et al.  Failure mechanism models for electromigration , 1994 .

[9]  Reader Aids,et al.  Failure-Mechanism Models for , 1992 .

[10]  Hiroshi Iwai Direction of silicon technology from past to future , 2001, Proceedings of the 2001 8th International Symposium on the Physical and Failure Analysis of Integrated Circuits. IPFA 2001 (Cat. No.01TH8548).

[11]  Michael Pecht,et al.  Electronic Hardware Reliability , 2000, Avionics.

[12]  J. Black Electromigration failure modes in aluminum metallization for semiconductor devices , 1969 .

[13]  G. Groeseneken,et al.  A fast and simple methodology for lifetime prediction of ultra-thin oxides , 1999, 1999 IEEE International Reliability Physics Symposium Proceedings. 37th Annual (Cat. No.99CH36296).

[14]  M. Pecht,et al.  Guidebook for managing silicon chip reliability , 1998 .