In-situ sensors for product reliability monitoring
暂无分享,去创建一个
Michael Pecht | Satchidananda Mishra | Douglas L. Goodman | Satchidanand Mishra | D. Goodman | Michael G. Pecht
[1] Chenming Hu,et al. Hot-electron-induced MOSFET degradation—Model, monitor, and improvement , 1985, IEEE Transactions on Electron Devices.
[2] Michael Pecht,et al. Evaluation of built-in test , 2001 .
[3] Chenming Hu,et al. Hot-Electron-Induced MOSFET Degradation - Model, Monitor, and Improvement , 1985, IEEE Journal of Solid-State Circuits.
[4] A. Davies,et al. Handbook of Condition Monitoring , 1998 .
[5] Michael Pecht,et al. ‘SMART’ ELECTRONIC SYSTEMS FOR CONDITION‐BASED HEALTH MANAGEMENT , 1997 .
[6] Michael Pecht,et al. Product Reliability, Maintainability, and Supportability Handbook , 1995 .
[7] Yibin Zhang,et al. TRENDS IN COMPONENT RELIABILITY AND TESTING , 1999 .
[8] Aristos Christou,et al. Failure mechanism models for electromigration , 1994 .
[9] Reader Aids,et al. Failure-Mechanism Models for , 1992 .
[10] Hiroshi Iwai. Direction of silicon technology from past to future , 2001, Proceedings of the 2001 8th International Symposium on the Physical and Failure Analysis of Integrated Circuits. IPFA 2001 (Cat. No.01TH8548).
[11] Michael Pecht,et al. Electronic Hardware Reliability , 2000, Avionics.
[12] J. Black. Electromigration failure modes in aluminum metallization for semiconductor devices , 1969 .
[13] G. Groeseneken,et al. A fast and simple methodology for lifetime prediction of ultra-thin oxides , 1999, 1999 IEEE International Reliability Physics Symposium Proceedings. 37th Annual (Cat. No.99CH36296).
[14] M. Pecht,et al. Guidebook for managing silicon chip reliability , 1998 .