Simulation of uniaxial tensile properties for lead-free solders with modified Anand model

Abstract The uniaxial tensile inelastic deformation behavior for three types of lead-free solders, Sn–3Ag–0.5Cu, Sn–3.5Ag and Sn–0.7Cu, were simulated by a unified viscoplastic constitutive model, the Anand model. To obtain the material parameters for the Anand model, a series of constant true strain rate and temperature tests were conducted on three types of lead-free solders at various strain rates from 1 × 10 −4  s −1 to 1 × 10 −2  s −1 , over a wide temperature range from 25 °C to 150 °C. A modified Anand model, in which h 0 was set to a function of strain rate, was proposed. The comparison of the experimental and simulated results showed that the modified Anand model improved the simulation capability.