Analysis of singular stresses in bonded bimaterial wedges by computed eigen solutions and hybrid element method

This paper concerns the determination of the singular stress fields in bonded bimaterial wedges under inplane loading. The mathematical complexity required for deriving the eigen solutions is avoided by an ad hoc developed one-dimensional finite element formulation. The computed eigen solutions are here adopted in the assumed stress fields of hybrid stress elements which are employed to determine the stress intensities. To illustrate the efficacy of the suggested procedure, stress intensities for cracks in homogeneous, interfacial cracks, bimaterial free edges and other configurations are computed and compared with the existing analytical/reference solutions. Copyright © 2001 John Wiley & Sons, Ltd.

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