论文信息 - High thermal conductivity underfill for the thermal management of three-dimensional (3D) chip stacks - 字舞流文

High thermal conductivity underfill for the thermal management of three-dimensional (3D) chip stacks

H. Kiritani | H. Mori | Y. Orii | Y. Kawase | Keiji Matsumoto | M. Ikemoto | M. Yamazaki | M. Sugiyama | F. Mizutani