Modular systems for sensor integration

New packaging concepts tend to higher levels of integration and implementation of passive components to reduce size and costs. Beside the reduction of the foot print area one approach for getting a further miniaturization of packages is the use of stackable, modular components to obtain a 3D and high density integration. A novel 3D package concept was developed. This micro system is a modular, stackable PCB package with a peripheral vertical bus structure, designed for sensor integration. A construction kit with three basic package elements was developed: a customized circuit board with BGA pads on bottom side, a frame and a top element that covers a single package layer or the complete stack. Test packages with a square base, dimensions of 12.5x12.5 mm 2 , 25x25 mm 2 as well as 40x40 mm 2 and three layers were build up and characterized. In functional sensor packages these three layers represent, from bottom to top, communication between package and surrounding, data analyzing and sensor integration. To reduce the overall costs of this package, the assembling of each layer was demonstrated on panels applying stencil printing and reflow soldering. The main objective of this project is the generation of design rules for organic 3D systems based on reliability investigations to set standards for such packages. This standardization would be the basis for a modular, multifunctionally applicable concept.