Reliability assessment of electronic components exposed to long-term non-operating conditions
暂无分享,去创建一个
Michael Pecht | F. P. McCluskey | Edward B. Hakim | J. Fink | A. Fowler | M. Pecht | F. McCluskey | E. Hakim | A. Fowler | J. Fink
[1] Michael Pecht,et al. Plastic packaged microcircuits: quality, reliability, and cost issues , 1993 .
[2] Anthony J. Rafanelli,et al. Plastic Encapsulated Microelectronics; Materials, Processes, Quality, Reliability, and Application , 1997 .
[3] Michael Pecht,et al. Comparison of plastic and hermetic microcircuits under temperature cycling and temperature humidity bias , 1992 .
[4] Michael Pecht,et al. Reliability evaluation of plastic encapsulated parts , 1993 .
[5] Sun Man Tam. Demonstrated reliability of plastic-encapsulated microcircuits for missile applications , 1995 .
[6] Michael Pecht,et al. Using plastic-encapsulated microcircuits in high reliability applications , 1994, Proceedings of Annual Reliability and Maintainability Symposium (RAMS).
[7] Edward B. Hakim. US Army Panama field test of plastic encapsulated devices , 1977 .
[8] Anthony J. Rafanelli,et al. Long-Term Non-Operating Reliability of Electronic Products , 1995 .