论文信息 - Electro-migration behavior in fine pitch SnBi eutectic solder bump interconnections

Electro-migration behavior in fine pitch SnBi eutectic solder bump interconnections

Electro-migration behavior in fine pitch SnBi eutectic solder bump interconnections were investigated. In the case of fine pitch SnBi eutectic solder bump (dia. 25 micro meter), maximum increasing-rate of resistance was significant less than that of larger seized bump structure (Dia. 75 micro meter).

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