Board Level Drop Impact—Fundamental and Parametric Analysis
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[1] Jason Wang Huijun,et al. MODELLING SOLDER JOINT RELIABILITY OF BGA PACKAGES SUBJECT TO DROP IMPACT LOADING USING SUBMODELLING , 2002 .
[2] Chwee Teck Lim,et al. Drop impact survey of portable electronic products , 2003, 53rd Electronic Components and Technology Conference, 2003. Proceedings..
[3] K. Newman,et al. BGA brittle fracture - alternative solder joint integrity test methods , 2005, Proceedings Electronic Components and Technology, 2005. ECTC '05..
[4] Suresh Goyal,et al. The role of case-rigidity in drop-tolerance of portable products , 1999 .
[5] Ephraim Suhir,et al. On a Paradoxical Phenomenon Related to Beams on Elastic Foundation: Could External Compliant Leads Reduce the Strength of a Surface-Mounted Device? , 1988 .
[6] Vincent B. C. Tan,et al. Mechanical response of PCBs in portable electronic products during drop impact , 2002, 4th Electronics Packaging Technology Conference, 2002..
[7] Ee Hua Wong. Dynamics Of Board-Level Drop Impact , 2005 .
[8] K. Tu,et al. Impact reliability of solder joints , 2004, 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).
[9] Kian Meng Lim,et al. Drop impact test - mechanics & physics of failure , 2002, 4th Electronics Packaging Technology Conference, 2002..