Effect of a hard coat layer on buckle delamination of thin ITO layers on a compliant elasto-plastic substrate: an experimental–numerical approach
暂无分享,去创建一个
den Jmj Jaap Toonder | van der O Olaf Sluis | Amir Abdallah | A. Abdallah | V. D. O. Sluis | D. Toonder | P. P. Timmermans | Phm Peter Timmermans | Pcp Bouten | Pcp Bouten | P. Bouten
[1] J. Hutchinson,et al. Influence of substrate compliance on buckling delamination of thin films , 2002 .
[2] Yves Leterrier,et al. Mechanical integrity of transparent conductive oxide films for flexible polymer-based displays , 2004 .
[3] B. Cotterell,et al. Buckling and cracking of thin films on compliant substrates under compression , 2000 .
[4] M. Thouless. Cracking and delamination of coatings , 1991 .
[5] N. Chandra,et al. Analysis of crack growth and crack-tip plasticity in ductile materials using cohesive zone models , 2003 .
[6] J. P. M. Hoefnagels,et al. In-situ characterization of interface delamination by a new miniature mixed mode bending setup , 2009 .
[7] Mario Gonzalez,et al. Stretching-induced interconnect delamination in stretchable electronic circuits , 2011 .
[8] Wei Wang,et al. The fracture of brittle thin films on compliant substrates in flexible displays , 2002 .
[9] J. Dundurs,et al. Discussion of Edge-Bonded Dissimilar Orthogonal Elastic Wedges under Normal and Shear Loading , 1969 .
[10] J. Hutchinson,et al. The influence of plasticity on mixed mode interface toughness , 1993 .
[11] C. Shih. Cracks on bimaterial interfaces: elasticity and plasticity aspects , 1991 .
[12] J. Dundurs. Discussion: ``Edge-Bonded Dissimilar Orthogonal Elastic Wedges Under Normal and Shear Loading'' (Bogy, D. B., 1968, ASME J. Appl. Mech., 35, pp. 460-466) , 1969 .
[13] G. Q. Zhang,et al. Numerical analysis of delamination and cracking phenomena in multi-layered flexible electronics , 2009, Microelectron. Reliab..
[14] J. Månson,et al. Calculation of adhesive and cohesive fracture toughness of a thin brittle coating on a polymer substrate , 2006 .
[15] M. Ortiz,et al. FINITE-DEFORMATION IRREVERSIBLE COHESIVE ELEMENTS FOR THREE-DIMENSIONAL CRACK-PROPAGATION ANALYSIS , 1999 .
[16] U. Schubert,et al. Buckle morphology of compressed inorganic thin layers on a polymer substrate , 2006 .
[17] J. Brokken-Zijp,et al. Subsurface cracking during indentation on hybrid coatings on polycarbonate , 2003 .
[18] P. Bouten,et al. Buckling failure of compressive loaded hard layers in flexible devices , 2004 .
[19] Y. Leterrier,et al. Internal stresses and adhesion of thin silicon oxide coatings on poly(ethylene terephthalate) , 2001 .
[20] Giulio Alfano,et al. An interface element formulation for the simulation of delamination with buckling , 2001 .
[21] Yves Leterrier,et al. Modeling of multiple cracking and decohesion of a thin film on a polymer substrate , 2006 .
[22] Piet C.P. Bouten,et al. On Integrity of Flexible Displays , 2005 .
[23] G. Q. Zhang,et al. Numerical prediction of failure paths at a roughened metal/polymer interface , 2009, Microelectron. Reliab..
[24] Thomas Pardoen,et al. Numerical analysis of the energy contributions in peel tests: A steady-state multilevel finite element approach , 2008 .
[25] Mgd Marc Geers,et al. ENHANCED SOLUTION CONTROL FOR PHYSICALLY AND GEOMETRICALLY NON-LINEAR PROBLEMS. PART I|THE SUBPLANE CONTROL APPROACH , 1999 .
[26] J. Hutchinson,et al. Nonlinear delamination mechanics for thin films , 1997 .
[27] Marc G. D. Geers,et al. Cohesive zone modeling for structural integrity analysis of IC interconnects , 2007, Microelectron. Reliab..
[28] Y. Tak,et al. Criteria for ITO (indium tin-oxide) thin film as the bottom electrode of an organic light emitting diode , 2002 .
[29] Z. Suo,et al. Mixed mode cracking in layered materials , 1991 .
[30] A. Evans,et al. The cracking and decohesion of thin films , 1988 .
[31] Willem D. van Driel,et al. Characterization of semiconductor interfaces using a modified mixed mode bending apparatus , 2008, Microelectron. Reliab..
[32] A. Abdallah,et al. Experimental study on buckle evolution of thin inorganic layers on a polymer substrate , 2010 .
[33] Anthony G. Evans,et al. An experimental study of the influence of imperfections on the buckling of compressed thin films , 2002 .
[34] K. Röll,et al. Analysis of stress and strain distribution in thin films and substrates , 1976 .
[35] B. Bowerman. Statistical Design and Analysis of Experiments, with Applications to Engineering and Science , 1989 .