Potentials of the 90 nm CMOS technology for monolithic integration

System on Chip and system in Package integration approaches should be seen as complementary rather than competitive. The CMOS technology can achieve high integration for digital functions and integrate the front-end circuit for communication making this technology suitable for single chip application or for subsystem in a complex system in package. Both state of the art performance active devices in 90nm RF CMOS technology and the innovative introduction of wafer level packaging Above IC passives gives unprecedented opportunities for circuit design for micro and millimeter wave applications in CMOS. These opportunities are illustrate with circuit demonstrators showing very good performances for noise figure, gain and also for ESD robustness.