Integrated waveguides for ultra-high speed interconnects

Integrated circuit technology is causing system designs to move towards complex architectures, requiring communication channels characterised by ever increasing capacity. In this context, classical metallic interconnects become a bottleneck, owing to the power consumption, crosstalk and signal integrity issues. Integrated Substrate Waveguides (SIW) are a potential technological solution to overcome traditional interconnect limitations. In the paper the Authors present frequency and time domain analysis of these structures, comparing two different SIW structures in terms of time and signal dispersion performances.

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