Rheological study of the curing kinetics of epoxy–phenol novolac resin

The curing reaction of an epoxy–phenolic resin under different conditions was monitored using rheological measurements. The evolution of viscoelastic properties, such as storage modulus, G′, and loss modulus, G″, was recorded. Several experiments were performed to confidently compare the rheological data obtained under varied curing conditions of temperature, catalyst concentration, and reactive ratios. The values of G′ measured at the end of the reactions (at maximum conversion) were independent of the frequency and temperature of the tests in the range of high temperatures investigated. The overall curing process was described by a second-order phenomenological rheokinetic equation based on the model of Kamal. The effects of the epoxy-to-phenolic ratio as well as the curing temperature and the catalyst concentration were also investigated. © 2006 Wiley Periodicals, Inc. J Appl Polym Sci 102: 4430–4439, 2006

[1]  L. Calabrese,et al.  Effect of CTBN rubber inclusions on the curing kinetic of DGEBA–DGEBF epoxy resin , 2003 .

[2]  F. Román,et al.  Vitrification and dielectric relaxation during the isothermal curing of an epoxy–amine resin , 2003 .

[3]  J. Riffle,et al.  Cresol novolac-epoxy networks: properties and processability , 2002 .

[4]  J. Y. Lee,et al.  Contributions of the network structure to the cure kinetics of epoxy resin systems according to the change of hardeners , 2002 .

[5]  J. G. Martín,et al.  Non-isothermal curing of a diepoxide–cycloaliphatic diamine system by temperature modulated differential scanning calorimetry , 2002 .

[6]  G. Assche,et al.  Modeling and experimental verification of the kinetics of reacting polymer systems , 2002 .

[7]  H. Ishida,et al.  Gelation study of high processability and high reliability ternary systems based on benzoxazine, epoxy, and phenolic resins for an application as electronic packaging materials , 2002 .

[8]  F. Fraga,et al.  Curing kinetic of the epoxy system badgen= 0/1,2 DCH by fourier transform infrared spectroscopy (FTIR): Curing Kinetic of the Epoxy System Badgen=0 , 2001 .

[9]  F. Fraga,et al.  Curing kinetic of the epoxy system badge n = 0/1,2 DCH by fourier transform infrared spectroscopy (FTIR) , 2001 .

[10]  M. I. Aranguren,et al.  Curing kinetics of epoxy-urethane copolymers , 2001 .

[11]  J. Cano,et al.  Effect of poly(styrene-co-acrylonitrile) on the curing of an epoxy/amine resin , 2001 .

[12]  M. Sankarapandian,et al.  Structure–property relationships of void-free phenolic–epoxy matrix materials , 2000 .

[13]  H. Yoon,et al.  Chemorheological study of biphenyl-type epoxy/ phenol novolac resin system , 1999 .

[14]  G. Eliçabe,et al.  Curing kinetics of divinyl ester resins with styrene , 1999 .

[15]  J. Djonlagic,et al.  Rheological study of the copolymerization reaction of acrylate-terminated unsaturated copolyesters with styrene , 1999 .

[16]  H. Ishida,et al.  Critical gel phenomena in the rheology of epoxide network formation , 1999 .

[17]  Ho Gyu Yoon,et al.  Cure kinetics of biphenyl epoxy‐phenol novolac resin system using triphenylphosphine as catalyst , 1999 .

[18]  K. Suh,et al.  Glass transition temperature of biphenyl-type epoxy/phenol novolac resin system , 1998 .

[19]  Saad A. Khan,et al.  Real-Time FTIR and in Situ Rheological Studies on the UV Curing Kinetics of Thiol-ene Polymers , 1997 .

[20]  H. Henning Winter,et al.  Rheology of Polymers Near Liquid-Solid Transitions , 1997 .

[21]  Gerard Franklyn Fernando,et al.  In situ cure monitoring of epoxy resins using optical fibre sensors , 1996 .

[22]  A. K. Banthia,et al.  Studies on the kinetics of free-radical bulk polymerization of multifunctional acrylates by dynamic differential scanning calorimetry , 1995 .

[23]  H. Winter,et al.  COMPOSITION DEPENDENCE OF THE VISCOELASTICITY OF END-LINKED POLY(DIMETHYLSILOXANE) AT THE GEL POINT , 1991 .

[24]  S. K. Venkataraman,et al.  Finite shear strain behavior of a crosslinking polydimethylsiloxane near its gel point , 1990 .

[25]  D. J. Boyle,et al.  Thermomechanical properties of 1C molding compounds , 1990 .

[26]  S. K. Venkataraman,et al.  Fourier transform mechanical spectroscopy of viscoelastic materials with transient structure , 1988 .

[27]  H. Winter,et al.  Linear Viscoelasticity at the Gel Point of a Crosslinking PDMS with Imbalanced Stoichiometry , 1987 .

[28]  H. Henning Winter,et al.  Analysis of Linear Viscoelasticity of a Crosslinking Polymer at the Gel Point , 1986 .

[29]  P. Dynes,et al.  Relationship between viscoelastic properties and gelation in thermosetting systems , 1982 .

[30]  M. E. Ryan,et al.  Kinetics of epoxy cure: a rapid technique for kinetic parameter estimation , 1979 .

[31]  Douglas R. Miller,et al.  A New Derivation of Post Gel Properties of Network Polymers , 1976 .

[32]  C. Macosko,et al.  A new derivation of average molecular weights of nonlinear polymers. , 1976, Macromolecules.

[33]  Musa R. Kamal,et al.  Differential scanning calorimetry of epoxy cure: isothermal cure kinetics☆ , 1976 .

[34]  Musa R. Kamal,et al.  Thermoset characterization for moldability analysis , 1974 .

[35]  J. K. Gillham,et al.  Epoxy Thermosetting Systems: Dynamic Mechanical Analysis of the Reactions of Aromatic Diamines with the Diglycidyl Ether of Bisphenol A. , 1973 .

[36]  D. Marquardt.  An Algorithm for Least-Squares Estimation of Nonlinear Parameters , 1963 .