2001 needs for multi-level interconnect technology

Looks at the materials and thermal alternatives for scaled, next-century VLSI/ULSI interconnects. It is shown that ad hoc executions of programs to calculate interconnect parameters for VLSI/ULSI design and analysis are too time-consuming to be practical. The tool used in this study to model a hypothetical interconnect system was Hewlett Packard's HTVE (HP Interconnect Value Extractor). >