论文信息 - Facet preparation of SOI waveguides by etching and cleaving compared to dicing and polishing

Facet preparation of SOI waveguides by etching and cleaving compared to dicing and polishing

We compared two different techniques of facet preparation of silicon-on-insulator (SOI) waveguides: The conventional by dicing and polishing and our proposed by dry etching the facets and cleaving along anisotropically etched cleaving grooves.

[1] R. Soref,et al. Large single-mode rib waveguides in GeSi-Si and Si-on-SiO/sub 2/ , 1991 .

[2] A. Stano,et al. Loss analysis and interference effect in semiconductor integrated waveguide turning mirrors , 1996, IEEE Photonics Technology Letters.

[3] Ivo Rendina,et al. Advances in silicon-on-insulator optoelectronics , 1998 .

[4] H. Heidrich,et al. 1.55 /spl mu/m BH-DFB laser with integrated spot-size converter for flip-chip applications , 2004, 16th IPRM. 2004 International Conference on Indium Phosphide and Related Materials, 2004..

[5] H. B. Harrison,et al. Self-alignment of optical fibers with optical quality end-polished silicon rib waveguides using wet chemical micromachining techniques , 1999 .