Optical Characterization and Defect inspection for 3D stacked IC technology
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[1] N. Launay,et al. 3D multi-stacking of thin dies based on TSV and micro-inserts interconnections , 2012, 2012 IEEE 62nd Electronic Components and Technology Conference.
[2] F. Quercioli,et al. An optical probe based on spherical aberration for surface figure testing , 1989 .
[3] Young-Sik Ghim,et al. Spectrally resolved white-light interferometry for 3D inspection of a thin-film layer structure. , 2009, Applied optics.
[4] R. Franiatte,et al. Localized Micro-Inserts Connection for Smart Card Secure Micro Packaging , 2005, 2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis.
[5] J. Lau. Evolution, challenge, and outlook of TSV, 3D IC integration and 3d silicon integration , 2011, 2011 International Symposium on Advanced Packaging Materials (APM).
[6] Rainer Wilhelm,et al. A novel low-coherence fibre optic interferometer for position and thickness measurements with unattained accuracy , 2006, Speckle: International Conference on Speckle Metrology.