Three-dimensional pattern transfer and nanolithography: modified soft molding

One-step transfer of molded three-dimensional polymer structures into underlying substrate is reported. The one-step transfer is made possible by a molding technique presented here in the form of modified soft molding. Formation of a desired three-dimensional structure in a polymer film by this method, followed by one-step reactive ion etching, is utilized for the transfer. The technique is also shown to be effective in transferring sub-100-nm features.