Mode suppressing packaging for 50 GHz cryogenic low-noise amplifiers

Hybrid cryogenic low-noise amplifiers are often enclosed in a metallic housing with several bias channels. Strict machining tolerance is necessary for solid clamping of the lid to avoid degradation in performance. A new packaging is proposed by applying photonic bandgap (PBG) structures; which greatly relaxes the tolerance on clamping, results in natural bias channels, suppresses higher order modes, and creates wide open access for assembly.

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