论文信息 - Modification and Characterization of Interfacial Bonding for Thermal Management of Ruthenium Interconnects in Next-Generation Very-Large-Scale Integration Circuits. - 字舞流文

Modification and Characterization of Interfacial Bonding for Thermal Management of Ruthenium Interconnects in Next-Generation Very-Large-Scale Integration Circuits.

Takanobu Watanabe | Yibin Xu | A. Ogura | Yen‐Ju Wu | Sujun Guan | T. Matsuki | R. Yokogawa | M. Tomita | T. Zhan | Zhicheng Jin | H. Takeuchi | Mengjie Song | K. Oda | Keita Sahara | Shikang Deng | Haidong Wang