Three dimensional high density MCM package assembly and analysis

This paper will present a novel approach to the design and assembly of three dimensional MCM packages. This technique is based on edge mounting chips on a substrate using solder bump technology. As no additional processing steps are required, the result is a very inexpensive assembly technique. In this paper, we present the process assembly flow, the thermal and electrical analysis, and the results of the application explorations. We show that the join electrical parasitics are very small (less than 0. 1 pF and 1 nH). Since the major heat removal path is through only one row of solder bumps, considerable thermal analysis was done. We show a thermal resistance of 25.12°C/W. On a silicon substrate, models predict an infinite stress life. Applications being explored include 3-D DRAM memory module, and 3-D RF and MEMS assemblies. The RF and MEMS assemblies are put together using standard Surface Mount components.