Failure Modes and Mechanisms: Failure Modes and Mechanisms in MEMS
暂无分享,去创建一个
[1] B. Bhushan. Springer Handbook of Nanotechnology , 2017 .
[2] Alberto Corigliano,et al. Modeling Impact-induced Failure of Polysilicon MEMS: A Multi-scale Approach , 2009, Sensors.
[3] Matthew Robert Brake,et al. The Sandia MEMS Passive Shock Sensor : FY08 failure analysis activities. , 2008 .
[4] Andreas C. Cangellaris,et al. Modeling of dielectric charging in RF MEMS capacitive switches , 2007 .
[5] Artur Wymyslowski,et al. Guest Editorial: 2013 EuroSimE International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems , 2007, Microelectron. Reliab..
[6] S. Choa,et al. Deformation Behavior of MEMS Gyroscope Sensor Package Subjected to Temperature Change , 2007, IEEE Transactions on Components and Packaging Technologies.
[7] J. Bielen,et al. Evaluation of Creep in RF MEMS Devices , 2007, 2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007.
[8] Siebe Bouwstra,et al. Critical comparison of metrology techniques for MEMS , 2007, SPIE MOEMS-MEMS.
[9] John Heck,et al. Metal contact reliability of RF MEMS switches , 2007, SPIE MOEMS-MEMS.
[10] S. Walwadkar,et al. Evaluation of Die Stress in MEMS Packaging: Experimental and Theoretical Approaches , 2006, IEEE Transactions on Components and Packaging Technologies.
[11] Mohammad I Younis,et al. Investigation of the response of microstructures under the combined effect of mechanical shock and electrostatic forces , 2006, Journal of micromechanics and microengineering : structures, devices, and systems.
[12] J.C.M. Hwang,et al. Temperature Acceleration of Dielectric Charging in RF MEMS Capacitive Switches , 2006, 2006 IEEE MTT-S International Microwave Symposium Digest.
[13] Tai-Ran Hsu,et al. Reliability in MEMS Packaging , 2006, 2006 IEEE International Reliability Physics Symposium Proceedings.
[14] C. Goldsmith,et al. Acceleration of Dielectric Charging in RF MEMS Capacitive Switches , 2006, IEEE Transactions on Device and Materials Reliability.
[15] L.L. Mercado,et al. Mechanics-based solutions to RF MEMS switch stiction problem , 2004, IEEE Transactions on Components and Packaging Technologies.
[16] M.G. Pecht,et al. Characterization of hygroscopic swelling behavior of mold compounds and plastic packages , 2004, IEEE Transactions on Components and Packaging Technologies.
[17] A. Gasparyan,et al. Effects of electrical leakage currents on MEMS reliability and performance , 2004, IEEE Transactions on Device and Materials Reliability.
[18] L.E. Felton,et al. Chip scale packaging of a MEMS accelerometer , 2004, 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).
[19] W. Brown,et al. Thickness and temperature dependence of stress relaxation in nanoscale aluminum films , 2003 .
[20] Harish Bhaskaran,et al. Reliability assessment of delamination in chip-to-chip bonded MEMS packaging , 2003 .
[21] Jeremy A. Walraven,et al. Anodic oxidation-induced delamination of the SUMMiT poly 0 to Silicon Nitride Interface , 2003, SPIE MOEMS-MEMS.
[22] Michael R. Douglass,et al. DMD reliability: a MEMS success story , 2003, SPIE MOEMS-MEMS.
[23] M. P. Boer,et al. Mechanics of microcantilever beams subject to combined electrostatic and adhesive forces , 2002 .
[24] R. Ballarini,et al. Fatigue Failure in Polysilicon Not Due to Simple Stress Corrosion Cracking , 2002, Science.
[25] V. T. Srikar,et al. The reliability of microelectromechanical systems (MEMS) in shock environments , 2002 .
[26] Marc Madou,et al. Fundamentals of Microfabrication , 2002 .
[27] T. Kenny,et al. Subcritical Crack Growth in Single-crystal Silicon Using Micromachined Specimens , 2002 .
[28] J.A. Higgins,et al. MEM relay for reconfigurable RF circuits , 2001, IEEE Microwave and Wireless Components Letters.
[29] S. Senturia. Microsystem Design , 2000 .
[30] Susanne Arney,et al. Anodic oxidation and reliability of MEMS polysilicon electrodes at high relative humidity and high voltages , 2000, SPIE MOEMS-MEMS.
[31] John C. Bravman,et al. Stress relaxation of free-standing aluminum beams for microelectromechanical systems applications , 2000 .
[32] C. Harper. Electronic Packaging and Interconnection Handbook , 2000 .
[33] H. Fujioka,et al. Properties of molding compounds to improve package reliability of SMDs , 1999 .
[34] B. MacGibbon,et al. The Effect of Thermophoresis on Particle Deposition in a Tungsten Low Pressure Chemical Vapor Deposition Reactor , 1999 .
[35] Adele E. Schmitz,et al. Surface-micromachined RF MEMs switches on GaAs substrates , 1999 .
[36] Terry A. Michalske,et al. Accurate method for determining adhesion of cantilever beams , 1999 .
[37] Stephen F. Bart,et al. Coupled Package-Device Modeling for MEMS , 1999 .
[38] B. Bhushan. Principles and Applications of Tribology , 1999 .
[39] Dhiraj K. Pradhan,et al. Integrated Circuit Manufacturability: The Art of Process and Design Integration , 1998 .
[40] R. T. Howe,et al. Stiction reduction processes for surfacemicromachines , 1997 .
[41] S.B. Brown,et al. Materials reliability in MEMS devices , 1997, Proceedings of International Solid State Sensors and Actuators Conference (Transducers '97).
[42] J. Maibach,et al. Variations in Young's modulus and intrinsic stress of LPCVD-polysilicon due to high-temperature annealing , 1995 .
[43] C. Hsu,et al. Mechanical stability and adhesion of microstructures under capillary forces. I. Basic theory , 1993 .
[44] C. Hsu,et al. Mechanical stability and adhesion of microstructures under capillary forces. II. Experiments , 1993 .
[45] Bharat Bhushan,et al. Tribology and Mechanics of Magnetic Storage Devices , 1990 .
[46] E. J. Rymaszewski,et al. Microelectronics Packaging Handbook , 1988 .
[47] E. A. Amerasekera,et al. Failure Mechanisms in Semiconductor Devices , 1987 .
[48] K.E. Petersen,et al. Silicon as a mechanical material , 1982, Proceedings of the IEEE.
[49] Yasuo Wada,et al. Grain Growth Mechanism of Heavily Phosphorus‐Implanted Polycrystalline Silicon , 1978 .
[50] B. V. Derjaguin,et al. Effect of contact deformations on the adhesion of particles , 1975 .
[51] Rajeshuni Ramesham,et al. Reliability, Packaging, Testing, and Characterization of MEMS and MOEMS II , 2007 .
[52] R. Puers,et al. A physical model to predict stiction in MEMS , 2006 .
[53] Gabriel M. Rebeiz. RF MEMS: Theory, Design and Technology , 2003 .
[54] B. Bhushan,et al. Introduction to Tribology , 2002 .
[55] Milton Feng,et al. Reliability Study of Low-Voltage RF MEMS Switches , 2002 .
[56] Douglas Ray Sparks,et al. Chip-scale packaging of a gyroscope using wafer bonding , 1999 .
[57] C. Mastrangelo. Suppression of stiction in MEMS , 1999 .
[58] Bharat Bhushan,et al. Tribology Issues and Opportunities in MEMS , 1998 .
[59] P. D. T. O’Connor,et al. Book Review: Failure mechanisms in semiconductor devices. By E.A.Amerasekera and F.N.Najm, Chichester:Wiley, 1997 , 1998 .
[60] Carlos H. Mastrangelo,et al. Surface Force Induced Failures in Microelectromechanical Systems , 1998 .
[61] R. Howe,et al. Critical Review: Adhesion in surface micromechanical structures , 1997 .
[62] S. Suresh. Fatigue of materials , 1991 .