Failure Modes and Mechanisms: Failure Modes and Mechanisms in MEMS

[1]  B. Bhushan Springer Handbook of Nanotechnology , 2017 .

[2]  Alberto Corigliano,et al.  Modeling Impact-induced Failure of Polysilicon MEMS: A Multi-scale Approach , 2009, Sensors.

[3]  Matthew Robert Brake,et al.  The Sandia MEMS Passive Shock Sensor : FY08 failure analysis activities. , 2008 .

[4]  Andreas C. Cangellaris,et al.  Modeling of dielectric charging in RF MEMS capacitive switches , 2007 .

[5]  Artur Wymyslowski,et al.  Guest Editorial: 2013 EuroSimE International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems , 2007, Microelectron. Reliab..

[6]  S. Choa,et al.  Deformation Behavior of MEMS Gyroscope Sensor Package Subjected to Temperature Change , 2007, IEEE Transactions on Components and Packaging Technologies.

[7]  J. Bielen,et al.  Evaluation of Creep in RF MEMS Devices , 2007, 2007 International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems. EuroSime 2007.

[8]  Siebe Bouwstra,et al.  Critical comparison of metrology techniques for MEMS , 2007, SPIE MOEMS-MEMS.

[9]  John Heck,et al.  Metal contact reliability of RF MEMS switches , 2007, SPIE MOEMS-MEMS.

[10]  S. Walwadkar,et al.  Evaluation of Die Stress in MEMS Packaging: Experimental and Theoretical Approaches , 2006, IEEE Transactions on Components and Packaging Technologies.

[11]  Mohammad I Younis,et al.  Investigation of the response of microstructures under the combined effect of mechanical shock and electrostatic forces , 2006, Journal of micromechanics and microengineering : structures, devices, and systems.

[12]  J.C.M. Hwang,et al.  Temperature Acceleration of Dielectric Charging in RF MEMS Capacitive Switches , 2006, 2006 IEEE MTT-S International Microwave Symposium Digest.

[13]  Tai-Ran Hsu,et al.  Reliability in MEMS Packaging , 2006, 2006 IEEE International Reliability Physics Symposium Proceedings.

[14]  C. Goldsmith,et al.  Acceleration of Dielectric Charging in RF MEMS Capacitive Switches , 2006, IEEE Transactions on Device and Materials Reliability.

[15]  L.L. Mercado,et al.  Mechanics-based solutions to RF MEMS switch stiction problem , 2004, IEEE Transactions on Components and Packaging Technologies.

[16]  M.G. Pecht,et al.  Characterization of hygroscopic swelling behavior of mold compounds and plastic packages , 2004, IEEE Transactions on Components and Packaging Technologies.

[17]  A. Gasparyan,et al.  Effects of electrical leakage currents on MEMS reliability and performance , 2004, IEEE Transactions on Device and Materials Reliability.

[18]  L.E. Felton,et al.  Chip scale packaging of a MEMS accelerometer , 2004, 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).

[19]  W. Brown,et al.  Thickness and temperature dependence of stress relaxation in nanoscale aluminum films , 2003 .

[20]  Harish Bhaskaran,et al.  Reliability assessment of delamination in chip-to-chip bonded MEMS packaging , 2003 .

[21]  Jeremy A. Walraven,et al.  Anodic oxidation-induced delamination of the SUMMiT poly 0 to Silicon Nitride Interface , 2003, SPIE MOEMS-MEMS.

[22]  Michael R. Douglass,et al.  DMD reliability: a MEMS success story , 2003, SPIE MOEMS-MEMS.

[23]  M. P. Boer,et al.  Mechanics of microcantilever beams subject to combined electrostatic and adhesive forces , 2002 .

[24]  R. Ballarini,et al.  Fatigue Failure in Polysilicon Not Due to Simple Stress Corrosion Cracking , 2002, Science.

[25]  V. T. Srikar,et al.  The reliability of microelectromechanical systems (MEMS) in shock environments , 2002 .

[26]  Marc Madou,et al.  Fundamentals of Microfabrication , 2002 .

[27]  T. Kenny,et al.  Subcritical Crack Growth in Single-crystal Silicon Using Micromachined Specimens , 2002 .

[28]  J.A. Higgins,et al.  MEM relay for reconfigurable RF circuits , 2001, IEEE Microwave and Wireless Components Letters.

[29]  S. Senturia Microsystem Design , 2000 .

[30]  Susanne Arney,et al.  Anodic oxidation and reliability of MEMS polysilicon electrodes at high relative humidity and high voltages , 2000, SPIE MOEMS-MEMS.

[31]  John C. Bravman,et al.  Stress relaxation of free-standing aluminum beams for microelectromechanical systems applications , 2000 .

[32]  C. Harper Electronic Packaging and Interconnection Handbook , 2000 .

[33]  H. Fujioka,et al.  Properties of molding compounds to improve package reliability of SMDs , 1999 .

[34]  B. MacGibbon,et al.  The Effect of Thermophoresis on Particle Deposition in a Tungsten Low Pressure Chemical Vapor Deposition Reactor , 1999 .

[35]  Adele E. Schmitz,et al.  Surface-micromachined RF MEMs switches on GaAs substrates , 1999 .

[36]  Terry A. Michalske,et al.  Accurate method for determining adhesion of cantilever beams , 1999 .

[37]  Stephen F. Bart,et al.  Coupled Package-Device Modeling for MEMS , 1999 .

[38]  B. Bhushan Principles and Applications of Tribology , 1999 .

[39]  Dhiraj K. Pradhan,et al.  Integrated Circuit Manufacturability: The Art of Process and Design Integration , 1998 .

[40]  R. T. Howe,et al.  Stiction reduction processes for surfacemicromachines , 1997 .

[41]  S.B. Brown,et al.  Materials reliability in MEMS devices , 1997, Proceedings of International Solid State Sensors and Actuators Conference (Transducers '97).

[42]  J. Maibach,et al.  Variations in Young's modulus and intrinsic stress of LPCVD-polysilicon due to high-temperature annealing , 1995 .

[43]  C. Hsu,et al.  Mechanical stability and adhesion of microstructures under capillary forces. I. Basic theory , 1993 .

[44]  C. Hsu,et al.  Mechanical stability and adhesion of microstructures under capillary forces. II. Experiments , 1993 .

[45]  Bharat Bhushan,et al.  Tribology and Mechanics of Magnetic Storage Devices , 1990 .

[46]  E. J. Rymaszewski,et al.  Microelectronics Packaging Handbook , 1988 .

[47]  E. A. Amerasekera,et al.  Failure Mechanisms in Semiconductor Devices , 1987 .

[48]  K.E. Petersen,et al.  Silicon as a mechanical material , 1982, Proceedings of the IEEE.

[49]  Yasuo Wada,et al.  Grain Growth Mechanism of Heavily Phosphorus‐Implanted Polycrystalline Silicon , 1978 .

[50]  B. V. Derjaguin,et al.  Effect of contact deformations on the adhesion of particles , 1975 .

[51]  Rajeshuni Ramesham,et al.  Reliability, Packaging, Testing, and Characterization of MEMS and MOEMS II , 2007 .

[52]  R. Puers,et al.  A physical model to predict stiction in MEMS , 2006 .

[53]  Gabriel M. Rebeiz RF MEMS: Theory, Design and Technology , 2003 .

[54]  B. Bhushan,et al.  Introduction to Tribology , 2002 .

[55]  Milton Feng,et al.  Reliability Study of Low-Voltage RF MEMS Switches , 2002 .

[56]  Douglas Ray Sparks,et al.  Chip-scale packaging of a gyroscope using wafer bonding , 1999 .

[57]  C. Mastrangelo Suppression of stiction in MEMS , 1999 .

[58]  Bharat Bhushan,et al.  Tribology Issues and Opportunities in MEMS , 1998 .

[59]  P. D. T. O’Connor,et al.  Book Review: Failure mechanisms in semiconductor devices. By E.A.Amerasekera and F.N.Najm, Chichester:Wiley, 1997 , 1998 .

[60]  Carlos H. Mastrangelo,et al.  Surface Force Induced Failures in Microelectromechanical Systems , 1998 .

[61]  R. Howe,et al.  Critical Review: Adhesion in surface micromechanical structures , 1997 .

[62]  S. Suresh Fatigue of materials , 1991 .