Heterogeneous system integration pseudo-SoC technology for Smart-health-care Intelligent Life Monitor Engine & Eco-system (Silmee)

Heterogeneous devices integration technologies constitute one of most promising driving forces of system integration as they enhance the system performance of electronics products. Currently, many technologies for heterogeneous devices integration have been reported [1]-[2]. The heterogeneous devices integration technologies that have been reported are mainly implemented for SoC (System on Chip) by applying the advantages of process compatibility between the devices. However, it has been impossible to integrate them in the case that the processes are incompatible. Also, many integration technologies applying SiP (System in Package) technology with the interposer substrate have been reported. However, SiP technology, it has been impossible to achieve high integration density comparable to that of monolithic integrated SoC because the interposer substrate occupies a large area in SiP. Accordingly, development of an advanced heterogeneous devices integration technology is required. In the previous work, pseudo-SoC realized by a wafer-level heterogeneous devices system integration technology, which incorporates MEMS and CMOS-LSI, has been studied to verify the validity [3]-[6]. In the work, the flexible pseudo-SoC for mobile terminal application was also verified [5]. Furthermore, in the previous work, high-density pseudo-SoC of AFE (Analog Front End) for Smart-health-care Intelligent Life Monitor Engine & Eco-system (SilmeeTM) application was developed [7]-[8]. In the application, 2 kinds of pseudo-SoC of AFEs which are for ECG (Electrocardiogram) and for Pulse were developed. However, developed pseudo-SoC of AFE has not sufficient density because the 2 kinds of pseudo-SoC of AFE occupy a large area in the Silmee engine. This paper describes the pseudo-SoC which integrated AFE circuit of ECG and Pulse in one microchip for Silmee application that incorporates several types of heterogeneous devices.

[1]  Hiroshi Yamada,et al.  Wearable wireless vital monitoring technology for smart health care , 2013, 2013 7th International Symposium on Medical Information and Communication Technology (ISMICT).

[2]  Hiroshi Toshiyoshi,et al.  A wafer-level system integration technology for flexible pseudo-SOC incorporates MEMS-CMOS heterogeneous devices , 2010, 2010 IEEE CPMT Symposium Japan.

[3]  Kazuhiko Itaya,et al.  A wafer-level heterogeneous technology integration for flexible pseudo-SoC , 2010, 2010 IEEE International Solid-State Circuits Conference - (ISSCC).

[4]  Kazuhiko Itaya,et al.  A Wafer-level System Integration Technology Incorporates Heterogeneous Devices , 2012 .