Microfabrication of electro- and electroless-deposition and its application in the electronic field

[1]  T. Osaka,et al.  Electroless Nickel Ternary Alloy Deposition on SiO2 for Application to Diffusion Barrier Layer in Copper Interconnect Technology , 2002 .

[2]  T. Yokoshima,et al.  Pulsed Electrodeposition of Nanocrystalline CoNiFe Soft Magnetic Thin Films , 2001 .

[3]  T. Osaka,et al.  Evaluation of Organic Monolayers Formed on Si(111): Exploring the Possibilities for Application in Electron Beam Nanoscale Patterning , 2001 .

[4]  Dong Nyung Lee,et al.  Microstructure of electroplated soft magnetic CoNiFe thin films , 2001 .

[5]  T. Osaka,et al.  Application of organic monolayers formed on Si(111) : possibilities for nanometer-scale patterning , 2001 .

[6]  T. Yokoshima,et al.  Electroless CoNiFeB soft magnetic thin films with high corrosion resistance , 2000 .

[7]  N. Ishiwata,et al.  Co-Ni-Fe write heads with a 10-/spl mu/m yoke length for high-speed recording , 2000 .

[8]  Tetsuya Osaka,et al.  Electrodeposition of highly functional thin films for magnetic recording devices of the next century , 2000 .

[9]  T. Yokoshima,et al.  High-frequency permeability and thermal stability of electrodeposited high-B/sub s/ CoNiFe thin films , 2000 .

[10]  T. Yokoshima,et al.  Increasing the resistivity of electrodeposited high B/sub S/ CoNiFe thin film , 1999 .

[11]  T. Yokoshima,et al.  Research and Development of High Performance Soft Magnetic Thin Films , 1999 .

[12]  T. Yokoshima,et al.  Effects of Saccharin and Thiourea on Sulfur Inclusion and Coercivity of Electroplated Soft Magnetic CoNiFe Film , 1999 .

[13]  T. Osaka,et al.  Corrosion Properties of Electroplated CoNiFe Films , 1999 .

[14]  T. Osaka,et al.  Effect of oxidized silicon surface on chemical deposition of nickel on n-type silicon wafer , 1999 .

[15]  Y. Shacham-Diamand,et al.  Integrated electroless metallization for ULSI , 1999 .

[16]  T. Osaka,et al.  Influence of Crystalline Structure and Sulfur Inclusion on Corrosion Properties of Electrodeposited CoNiFe Soft Magnetic Films , 1999 .

[17]  T. Osaka.  Recent development of Magnetic recording head core materials by plating method , 1999 .

[18]  K. Ohashi,et al.  Write performance of heads with 2.1-Tesla CoNiFe pole , 1999, IEEE International Magnetics Conference.

[19]  R. Boukherroub,et al.  New Synthetic Routes to Alkyl Monolayers on the Si(111) Surface1 , 1999 .

[20]  T. Yokoshima,et al.  Investigation of Fabrication Process for Writing-Head Cores Using Electroless CoFeB Plating , 1999 .

[21]  W. Dressick,et al.  Channel‐Constrained Electroless Metal Deposition on Ligating Self‐Assembled Film Surfaces , 1999 .

[22]  Tetsuya Osaka,et al.  Mechanism of the Chemical Deposition of Nickel on Silicon Wafers in Aqueous Solution , 1999 .

[23]  Y. Shacham-Diamand,et al.  Electrochemically deposited thin film alloys for ULSI and MEMS applications , 1999 .

[24]  Panayotis C. Andricacos,et al.  Damascene copper electroplating for chip interconnections , 1998, IBM J. Res. Dev..

[25]  Tetsuya Osaka,et al.  Newly developed inductive write head with electroplated CoNiFe film , 1998 .

[26]  J. Pinson,et al.  Organic monolayers on Si(111) by electrochemical method , 1998 .

[27]  Tetsuya Osaka,et al.  A soft magnetic CoNiFe film with high saturation magnetic flux density and low coercivity , 1998, Nature.

[28]  T. Osaka,et al.  Electrodeposition of Soft Magnetic Ni-Fe-based Film with High Resistivity , 1998 .

[29]  K. Youcef-Toumi,et al.  Fabrication of Large Area Nanostructured Magnets by Interferometric Lithography , 1998, 7th Joint MMM-Intermag Conference. Abstracts (Cat. No.98CH36275).

[30]  Tetsuya Osaka,et al.  New soft magnetic CoNiFe plated films with high B/sub s/=2.0-2.1 T , 1998 .

[31]  Y. Shacham-Diamand,et al.  High aspect ratio quarter-micron electroless copper integrated technology , 1997, European Workshop Materials for Advanced Metallization,.

[32]  Hideto Watanabe,et al.  Electroless Nickel Plating Using DMAB as 2nd Reducing Agent , 1997 .

[33]  Wei Zhang,et al.  Sub-10 nm imprint lithography and applications , 1997, 1997 55th Annual Device Research Conference Digest.

[34]  J. Pinson,et al.  Electrochemical Formation of Close-Packed Phenyl Layers on Si(111) , 1997 .

[35]  K. Aoki,et al.  Soft magnetic films by electroless Ni-Co-P plating , 1995 .

[36]  K. Aoki,et al.  Preparation of Soft Magnetic Films by Electroless Ni-Fe-P Plating , 1994 .

[37]  W. Dressick,et al.  Patterning of self-assembled films using lithographic exposure tools , 1993 .

[38]  Seiichi Tagawa,et al.  Polymers for Microelectronics Resists and Dielectrics , 1993 .

[39]  Richard M. Crooks,et al.  Scanning Probe Lithography. 1. Scanning Tunneling Microscope Induced Lithography of Self-Assembled n-Alkanethiol Monolayer Resists , 1993 .

[40]  H. Craighead,et al.  Self‐assembled monolayer electron beam resist on GaAs , 1993 .

[41]  J M Calvert,et al.  Deep UV photochemistry of chemisorbed monolayers: patterned coplanar molecular assemblies. , 1991, Science.

[42]  哲彌 逢坂,et al.  無電解めっき法による CoB 軟磁性薄膜の作製 , 1990 .

[43]  C. Tsang,et al.  Gigabit density recording using dual-element MR/Inductive heads on thin-film disks , 1990, International Conference on Magnetics.

[44]  TodaFumio,et al.  SYNTHESIS AND REACTIONS OF NEW HIGHLY STRAINED UNSATURATED PROPELLANES, [4.2.1]PROPELLA-2,4,7-TRIENES , 1978 .

[45]  Tetsuya Osaka,et al.  Fabrication of electroless NiReP barrier layer on SiO2 without sputtered seed layer , 2002 .

[46]  T. Osaka,et al.  Fabrication of Nickel Dots Using Selective Electroless Deposition on Silicon Wafer , 1998 .